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Research on Modeling of Digital Prototyping and Simulation Analysis for Electronic Equipment

Author: GuoJianZuo
Tutor: GuoWei
School: Tianjin University
Course: Mechanical Manufacturing and Automation
Keywords: electronic equipment digital prototyping intelligent products master model thermal analysis dynamics analysis
CLC: TN02
Type: Master's thesis
Year: 2008
Downloads: 204
Quote: 1
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Abstract


Since long the traditional electronic equipment structural design mostly pauses in tradition design methods, like static analogy, empirical design, prototypical experiment and so on, the main shortcomings of which approach is to design long cycle and high cost. The development of digital design technology makes the research and development system change to“structure knowledge and analysis based design”.A whole digital prototyping of electronic equipment can be established through systematic knowledge management, multi-disciplinary analysis and optimization of synergies, to shorten the time of design cycle and cut costs. This paper has carried out the research and the exploration to the digital prototyping of electronic equipment. The research content and the achievement mainly manifests in the following several aspects.1. Study digital design and development technology and digital prototyping technology. And establish an overall framework of electronic equipment digital prototyping based on intelligent products master model.2. Electronic equipment thermal design and analysis theory has been studied. And carry through the simulation and analysis on electronic equipment by using thermal analysis software-FLOTTHERM. For analysis objects of thermal design, the optimization design solution has been designed to improve thermal reliability of electronic equipment.3. Study dynamic characteristics of circuit board, who is one of the main components of electronic equipment. And analyze anti-vibration-reducing properties of printed circuit board by using FEM analysis software-ANSYS WORKBENCH. At last, the paper designs a optimization design solution.4. Study the multi-disciplinary cooperation optimization of electronic component level model. Cooperation optimization of dynamic and thermal properties of the printed circuit board is carried through. And the paper proposed a comprehensive optimization design solution. The study of this paper makes a great sense to electronic equipment digital prototyping and cooperation optimization design.

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