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Design and Performance Study for AlN as the Gate Dielectric Material Applied to Nano-scale MOS Devices

Author: ZhuJiaJun
Tutor: YangHongGuan;JiangAiGuo
School: Hunan University
Course: Electronics and Communication Engineering
Keywords: Nano- MOSFET High-k materials AlN films DC reactive magnetron sputtering Breakdown field
CLC: TN386.1
Type: Master's thesis
Year: 2009
Downloads: 49
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Abstract


With the rapid development of microelectronics technology , semiconductor device feature sizes continue to shrink in accordance with Moore's Law , SiO2 as the gate dielectric material in the next few years will be difficult to meet the requirements of this trend , as a background to the next generation of nano- MOSFET high-k gate dielectric materials, microelectronics become a research hotspot . AlN film has a unique set of physical and chemical properties , the electrical, optical , acoustical and mechanical aspects have broad application prospects. In particular having a high thermal conductivity AlN , high resistivity , breakdown field strength , thermal expansion coefficient and GaN, GaAs and other commonly used semiconductor materials to match these properties , it is widely used. In this paper, a new generation of nano- AlN thin insulating gate dielectric MOS devices has carried out some research work . First, an overview of AlN thin films , applications and research situation , the dielectric constant from the material , the band gap , the thermal stability of the Si interface quality, process compatibility , reliability, and other aspects of a comprehensive analysis of AlN nano MOS devices the possibility of the gate dielectric material . Secondly , the calculation and analysis Alternate SiO2 as the gate dielectric AlN nano material change in electrical characteristics of MOS devices found in the given initial conditions, the structure of the device can withstand the gate voltage of 4.3V , the source - drain saturation current of 5.62 × 10-9A, the tunneling current can be reduced to about 10-7A/cm2 . Can be significantly improved due to the size reduction of the dielectric layer of tunneling current increases . Finally, the article by DC reactive magnetron sputtering a high breakdown field strength and analyzed AlN insulating film preparation conditions on the deposition of AlN thin film electrical properties . Studies show that , working pressure , the nitrogen concentration and the substrate temperature and other factors will significantly affect the quality crystalline AlN films and the organizational structure , thereby affecting its electrical properties. Maintaining the stability of other process parameters , the working pressure of 0.5 ~ 1.2Pa, a nitrogen concentration of 70 to 80%, the substrate temperature is 400 ℃, good performance can be deposited on the crystal , preferred orientation and high electrical performance of the AlN films .

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Semiconductor technology > Field-effect devices > Metal - oxide - semiconductor (MOS) devices
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