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Tetramethyl biphenol epoxy / o-cresol formaldehyde epoxy resin blends Preparation and Properties

Author: TuKuiFeng
Tutor: NaHui
School: Jilin University
Course: Polymer Chemistry and Physics
Keywords: Electronic Packaging Epoxy Blends Solidify Thermal Performance
CLC: TQ323.5
Type: Master's thesis
Year: 2010
Downloads: 175
Quote: 1
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Abstract


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CLC: > Industrial Technology > Chemical Industry > Synthetic resins and plastics industry > Polycondensation resin and plastic > Epoxy resins and plastics
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