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MEMS wafer-level technology of glass solder sealing and thermal stress analysis

Author: SunFenFen
Tutor: WuZuo
School: Nanjing University of Technology and Engineering
Course: Materials Science
Keywords: Microelectromechanical systems Wafer Level Packaging Glass solder Thermal stress Finite Element Analysis
CLC: TQ171.68
Type: Master's thesis
Year: 2010
Downloads: 117
Quote: 0
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Abstract


Glass solder as a sealing material printed on the wafer by low temperature bonding multiple chips simultaneously sealed , the resulting product is not only good air tightness , low cost and high bonding strength , good reliability . In this paper, experimental and finite element analysis are two methods by combining MEMS wafer-level glass solder sealing process and thermal stress research , to develop better packaging technology, to provide a reference for the bulk of industrial production . By the finite element method for bonding the thermal stress analysis, the maximum thermal stress in the solder glass, the outer contact surface with the silicon corner , followed by inner and outer edges of the glass solder ; using a smaller thermal expansion coefficient and elastic modulus of the sealing material can reduce the thermal stress ; glass solder linewidth has little effect on the thermal stress , the greater the thickness and thermal bonding temperature the greater the stress . After screen printing, the process of pre-sintered and bonded experimental study and finite element analysis to determine the more appropriate encapsulation process parameters: screen- printed with a line width of 0.3mm, using a rubber squeegee pressure of 40N printing , Stripping speed of 2mm / s; pre-sintering , and a peak temperature of 440 ℃ heat 10min; bonding temperature 440 ℃, pressure bonding 30KPa, the cooling rate after bonding 10 ℃ / min, the solder thickness of 0.005mm-0.01mm. Right after the package unit bond shear strength tests found mainly in the glass solder failure . After bonding the glass solder for the phenomenon of excessive width is improved by a method using the morphology of the etched grooves preferably glass solder ring , etched groove width is 0.4mm or 0.5mm, preferably at a depth of 0.01mm ; a groove obtained by bonding the glass solder is less than the thermal stress of bonding without slot thermal stress . For process improvement package unit testing, air tightness test pass rate of 90% , the reliability test pass rate of 85% , the shear strength test pass rate of 100%. The results show that the process has been optimized to meet the standards and performance products .

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CLC: > Industrial Technology > Chemical Industry > Silicate > Glass Industry > Production process and equipment > Products processing ( re- forming ) and equipment
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