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Advanced 3D stacked chip packaging technology and Reliability
Author: WangAiXiu
Tutor: DingShiJin
School: Fudan University
Course: Electronics and Communication Engineering
Keywords: 3D stacked Package Reliability
CLC: TN405
Type: Master's thesis
Year: 2011
Downloads: 194
Quote: 0
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Abstract
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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Microelectronics, integrated circuit (IC) > General issues > Manufacturing process
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