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Research on Diallyl Bisphenol A Modified Bismaleimide High-temperature Adhesive

Author: LuoTian
Tutor: WeiMingKun
School: Wuhan University of Technology
Course: Applied Chemistry
Keywords: Diallyl bisphenol A Epoxy resin Bismaleimide High temperature adhesives
CLC: TQ433
Type: Master's thesis
Year: 2010
Downloads: 146
Quote: 0
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Abstract


Bismaleimide (BMI) by Rhone-Poulenc of France at the end of the 1960s, the successful development and industrial production. BMI double bond distance is very short, the crosslinking density is higher, so that it has excellent heat resistance, corrosion resistance, insulation resistance and dimensional stability, and having stable electrical performance in a wide temperature range, nearly 30 years abroad, the rapid development of composite resin matrix. However, BMI homopolymer its own fragility great, used in the preparation process of the composite material is poor, so it must be modified to expect to get good overall performance, good craft resin matrix composites. Further, the BMI of the double bond in higher activity, containing active hydrogen organic compounds such as allyl or an unsaturated bond-containing compound, an epoxy resin, polyamine obtained by reacting with various modified. The topics selected bismaleimide resin matrix, diallyl bisphenol A modified bismaleimide high temperature composite resin matrix for the study, the use of physical and chemical methods to its modified the use of modern analytical techniques for composite matrix were characterized by a comprehensive study of the composition of the matrix structure, thermal properties and mechanical properties. (1) bismaleimide (BMI) /--allyl bisphenol A (DABPA) binary system as the substrate, the mechanical properties of test to determine the best ratio of BMI: Dabra = 4:1 (mass ratio), using Fourier transform infrared spectroscopy characterization shows observed scanning calorimetry and dynamic mechanical analysis were investigated the BMI / DABPA the curing reaction, and to develop the theory curing temperature of the system; combined shows observed scanning calorimetry, thermogravimetry analysis and dynamic mechanical analysis of the test results of the system thermodynamics, dynamic mechanical properties of the cured product. (2) In the bismaleimide (BMI) / the diallyl bisphenol A (DABPA,) / bisphenol A type epoxy resin (E-51) ternary complex system as a basis, determined by mechanical testing best ratio for BMI: DABPA: E-51 = 4:1:1 (mass ratio), the use of Fourier transform infrared spectroscopy characterization shows police scanning calorimetry and dynamic mechanical analysis were investigated the BMI / DABPA system curing reaction and draw up the curing temperature of the system theory; combined shows police scanning calorimetry, thermogravimetric analysis and dynamic mechanical analysis of the test results of the system thermodynamics, dynamic mechanical properties of the cured product. (3) In the bismaleimide (BMI) / diallyl bisphenol A (DABPA) / nano rubber particles modified bisphenol A type epoxy resin (E-51) ternary complex system as the basis, through mechanical testing to determine the best ratio for BMI: DABPA: E-51 = 4:1:1 (mass ratio), the use of Fourier transform infrared spectroscopy characterization shows police scanning calorimetry and dynamic mechanical analysis were investigated BMI / the curing reaction of the the DABPA system, and to develop a theory curing temperature of the system; combined said police scanning calorimetry, thermogravimetric analysis and dynamic mechanical analysis of the test results of the system thermodynamics, dynamic mechanical properties of the cured product. Found by the study on the comparison of the two parts of the second and third by nano-rubber-modified epoxy resin and a bismaleimide / diallyl bisphenol A copolymerization of adhesive than with a general epoxy resin with bis the maleimide / diallyl bisphenol A copolymer synthetic adhesive thermal performance and mechanical properties are improved, when BMI: DABPA: E-51 (nano-rubber modified) = 4:1:1 (mass ratio ) when the adhesive glass transition temperature and thermal decomposition temperature was increased to 251.216 ℃ and 330 ° C of 250 ° C the adhesive strength of 6.7MPa.

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CLC: > Industrial Technology > Chemical Industry > Adhesive Industry > Synthetic adhesive
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