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Research of SI Model and Simulation Technology for High-speed PCB System

Author: LiuZuoMing
Tutor: CaoYueSheng
School: National University of Defense Science and Technology
Course: Computer Science and Technology
Keywords: Transmission line Characteristic impedance Signal Integrity Power Integrity Connector Vias High-speed serial transmission IBIS SPICE Multi-board Circuit simulation
CLC: TN402
Type: Master's thesis
Year: 2007
Downloads: 391
Quote: 8
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Abstract


Rapid development in the field of electronic design, making electronic system is moving in the direction of large-scale, small-volume and high-speed integrated circuits, and how to solve the system as well as the PCB signal integrity problem has become a high-speed electronic systems design success of the key. The key factor in the board-level signal integrity, transmission line model and its high-frequency effects, reflection and crosstalk, the basic architecture of the high-speed serial data transmission SERDES and high-speed signal simulation model structure carried out in-depth research. Proposed theoretical method based on multiple vias and differential vias modeling and parameter optimization, and simulation results on the frequency-domain and time-domain analysis. Implement in order to achieve a balance of accuracy and speed, the combination of high-speed circuit analysis and simulation in the \Research model not only sometimes domain circuit model, such as I / O Buffer SPICE and IBIS models, as well as frequency domain electromagnetic model S-parameter models, such as the backplane connector, and the validity of the model is verified by simulation. Finally, the establishment of a multi-board simulation model using the test circuit board, and key network simulation analysis, a useful discussion for PCB design and simulation of large-scale electronic systems such as high-performance computers. The innovation of this paper include: (1) Stub (short column) effect for hole, full-wave 3D electromagnetic field simulation tools and modeling of a variety of structures vias and differential vias, specific analysis and research the vias anti-drilling technology (Back-Drilling), differential vias, with the protectorate hole vias (differential) frequency response characteristics of the hole, as well as the impact of high-frequency transmission. (2) based time domain frequency domain electromagnetic field S-parameter hybrid simulation technology, complete the frequency domain electromagnetic simulation tool used time-domain simulation of multi-plate model (S-parameter model), the time-domain simulation results (such as eye diagrams. ). (3) high-speed SERDES serial signal drive (Buffer) model analysis, research and analysis of serial circuit driving principle and the structure of the model (Buffer), and the practical application of a high-speed serial Buffer SPICE circuit model as input / output drive multi-board simulation. (4) The big drawback for the lumped parameter model error, breadboard to build a multi-board simulation environment to extract and use the differential through hole and GBX connector, the exact parameters of the model, to achieve high-precision 3.125Gbps the high speed SDRDES more boards emulation.

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Microelectronics, integrated circuit (IC) > General issues > Design
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