Dissertation > Excellent graduate degree dissertation topics show

Experimental Study of Ultra-Fine-Pitch Wire Bonding Processing

Author: YangWenJian
Tutor: LiXiaoPing
School: Huazhong University of Science and Technology
Course: Mechanical and Electronic Engineering
Keywords: Ultra fine pitch Wire bonding Chip package Orthogonal Test
CLC: TN405
Type: Master's thesis
Year: 2005
Downloads: 349
Quote: 2
Read: Download Dissertation

Abstract


With the development of market and technology, the chip functions continue to be enhanced, and lead more and more, while the volume is getting smaller and smaller share of the entire chip area than rising, leading to the pads (pad), and therefore, the study of ultrafine pitch (ultra-Fine-pitch) bonding technology is a key technology to solve chip miniaturization must solve. Wire bonding process in the chip manufacturing process after a direct impact on the reliability and cost of integrated circuits and devices. China's wire bonding equipment and related technologies are also dependent on imports, become a bottleneck restricting the development of the microelectronics manufacturing industry. Research and development of bonding technology is conducive to the transformation of some of our traditional manufacturing enterprises with independent intellectual property rights, to break the monopoly of foreign technology to promote the advancement of technology related industries in China has a very important significance. From microelectronics manufacturing IC package technology start generation of microelectronic packaging, the status and role of the main forms of microelectronic packaging, basic functions and levels, and the advantages and disadvantages of the different packaging process, and the current package technical characteristics and development trend analysis. In this paper, the core wire bonds together the relevant technical detail and analysis. The chip welding equipment, wire bonding, the main processes and trends, and to lay the foundation for the ultra fine pitch wire bonding test analysis and research. Ultra fine pitch wire bonding part of the parameters to push their physical limits, require smaller diameter gold ball (free air ball) and bonded ball (bonded ball), the gold wire diameter is smaller. Test to select KS 8028S type 1484XQ wire bonding machine and the joint development of 45 WB-950 wire bonder were selected as a test platform, observation and measurement equipment XTL-1 color television microscope and Buchler 1500-6400 measuring instrument. Wire bonding in-depth analysis, and to identify the best possible pilot program are well prepared for the official test study. Official test selection orthogonal test method as the basis for the design of the pilot study. Mathematical statistical point of view, the application of the principle of orthogonality, the selection of an appropriate amount of a representative from a large number of trials, the typical point of the test, according to the orthogonal table \Law and trend graphs to analyze the test results. By the end of the line, the Golden Globe, bonded ball bonding quality extensive technology test many influencing factors, and ultimately summed meet 60μm ultra-fine pitch wire bonding key parameters investigated. Experimental study of the main factors affect a variety of ultra-fine pitch wire bonding key technologies-depth study of the impact of fine-pitch wire bonding mechanism and laws laid the foundation for the next phase.

Related Dissertations

  1. Powered Activited Carbon-UF for Treating Micro-polluted Surface Water,X703
  2. Process Optimization and Degradation Kinetics for Microwave Vacuum Drying of Different Traditional Chinese Medicine Extract,TQ461
  3. Study on Extracting Process of Rhizoma Alismatis and Rhizoma Smilacis Glabrae and Their Hypouricemic Effects,R284
  4. The Research of Synthesis of Bisphenol-A Polycarbonate Through Melt Transesterification Process,TQ323.41
  5. Applied Research of Emulsified Fuel on S195 Diesel Engine,TE626.24
  6. Investigation of Plasma Sprayed NiCr-Cr3C2 Coating on Mould CrZrCu Alloy Plates,TG174.442
  7. Research of Testing Methods and Set-up for Phase Change Random Access Memory,TP333
  8. Digital T / R module transceiver front-end design and research,TN957
  9. The Influence Analysis of the Design Parameters of Large-span High Piers Bend Continuous Rigid-framed in the Natural Oscillation and Earthquake Response,U441.3
  10. Development of High-performance Modified Asphalt Emulision for Ultra-thin Wearing Course Interlayer Bonding Materials,U414
  11. Optimization of the process parameters of the cigarette filter rod forming equipment opener,TS43
  12. Study on Organic Additives Applied to Electrodeposited Copper Foil,TF811
  13. Design and Simulation of Pressure Casting Process for Magnesium Steering Wheel,TG249.2
  14. Formulation Design and Performance Studies on Silicate Heat-insulating Coating,TQ630.7
  15. Study on the Preparation and the Quality Standards of the Wuhuo Depressurization Dripping Pills,TQ461
  16. Investigation of the Needleless Electrospinning Processes,TQ340.6
  17. Preparation Organic Multi-Fertilizer Contain Silicon from Coal Gangue/Coal Ash and Crop Straw,TQ444
  18. Process Optimization for Injection-Compression Molding Based on CAE,TQ320.662
  19. The Study on Extraction of Asparagus Peel Flavonoid and Its Antioxidation Effect,TQ461
  20. Study on the Processing Parameters on Mechanical Properties of Microcellular Injection Molded Parts,TQ320.662
  21. Study on Morphology of Supercritical Microcellular Injection Molded Polycarbonate Parts,TQ328.0

CLC: > Industrial Technology > Radio electronics, telecommunications technology > Microelectronics, integrated circuit (IC) > General issues > Manufacturing process
© 2012 www.DissertationTopic.Net  Mobile