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Tungsten copper electronic packaging materials engineering

Author: ChenDeXin
Tutor: WangZhiFa
School: Central South University
Course: Materials Science
Keywords: W / Cu composite Infiltration Thermal conductivity Leukoplakia
CLC: TN304
Type: Master's thesis
Year: 2005
Downloads: 322
Quote: 1
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Abstract


W / Cu electronic packaging material has excellent thermal conductivity and coefficient of thermal expansion can be adjusted , and is preferred by the domestic and foreign military electronic components , especially the solid-state phased array radar electronic packaging materials . Electronic packaging materials developed by the Institute of Central South University W / of Cu electronic packaging materials performance is close to the international level of similar products for military users of more than 100,000 . But with the variety of parts of the W / Cu electronic packaging materials , specifications more and more , the increasingly high performance requirements , the original production technology and equipment in the mass production process revealed some new problems , mainly in: thermal conductivity stability is not enough ; the product surface leukoplakia phenomena ; engineering research from improving the tungsten powder particle size distribution , optimize infiltration sintering process start the analysis of the causes of the above problems , and by means of scanning electron microscopy of the morphology of the material the observation results showed that : 1) at 1350 ℃ infiltration preferably , the product obtained in one hour thermal performance , infiltrated tissue is relatively uniform . 2) with Fsss 5.6μm tungsten powder , the induced copper powder of the addition of 1% to 2.5 % , at atmospheric pressure , can be made that the relative density is 72.46% of the high density tungsten green body , after infiltration He adsorption small at 1.0 × 10 -9 < / sup > Pa · m 3 · s -1 . 3) copper is the main thermal conductivity in the composite material component , its purity greater impact, the thermal conductivity can be obtained with a purity of 99.9% of the copper powder , the thermal conductivity of 200W · m -1 K < the above sup> -1 W/Cu15 material. 4 ) tungsten powder particle size mainly by how much of the impact of the distribution of the copper network interface to influence the thermal conductivity. Comprehensive suppress the performance and economic factors , the mixed tungsten powder has the better value in use . 5 ) the greater the residual stress of the composite interface , the thermal conductivity of the worse . W / Cu infiltration after annealing in hydrogen under the protection of the thermal conductivity of up to 180W · m -1 < / sup > · K -1 < / sup> above , and small dispersion data and stable performance. 6 ) tungsten copper electronic packaging materials production in the surface of the white spots appear mainly determined by the form of powder compaction before . Before pressing the powder moderate milling, to reduce aggregation of the fine powder particles can be obtained a good effect .

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Semiconductor technology > General issues > Material
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