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With the rapid development of the semiconductor industry, chip integration continued to improve, increasing the size of the silicon wafer as a substrate material requirements, getting smaller and smaller feature sizes, precision silicon processing will become of them critical factor. Wherein grinding is to ensure that the foundation of the silicon substrate sheet parallelism, flatness, surface perfection. The quality of the silicon wafer surface after the polishing is determined by the performance of the polishing liquid, while the performance of the polishing solution is determined by which the main chemical components. At home and abroad are increasingly concerned about the performance of the grinding fluid. Grinding fluid formulation studies to play a crucial role for the promotion of the development of the integrated circuit industry, has important scientific value in the field of wafer processing. The topic for the existing problems in the the silicon grinding process slurries as well as slurries, and combined with the key project of the Semiconductor Materials Co., Ltd., Shanghai Xinyang wafer grinding fluid development, its specific research . First, the introduction brief introduction to the topics of the background as well as silicon process; analysis in the second chapter of the main factors affecting the grinding quality, and develop the the polishing liquid ingredients and recipe optimization test program for these factors; Chapter experimental section is the focus of this dissertation, several important components of the polishing liquid single factor tests and experimental analysis of the suspension of suspending agent with the abrasive relationship, the relationship of the surfactant with the silicon wafer surface smoothness , the chelating agent with silicon surface-adsorbed metal ion content of the relationship, such as a series of key issues, and by means of SEM, EDS, and other means of silicon wafer after grinding, and grinding fluid characterized to obtain the basic recipe: organic bases B, SC B (acrylic resin), a surfactant 6501 amino acids B, and defoamers the CF 643; Chapter IV formulations were optimized by the orthogonal, the formulations finally obtained: suspension agent content of 1.5 wt%, the organic alkali content of 6% by weight, the surfactant content of 1% wt, chelating agent content of 0.1 wt%; Finally, the full text is summarized. In summary, the present paper, by the large number of tests, developed a high suspension properties, chelating ability, and high dilution capacity wafer polishing liquid, largely effectively improve the quality of the surface of the wafer after grinding for the next the global planarization laid the foundation.
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