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Failure Analysis Application in Advanced Semiconductor Process

Author: ZhengXiaoGang
Tutor: YaoSuYingï¼›LiRiZuo
School: Tianjin University
Course: Electronics and Communication Engineering
Keywords: Etching Ion implantation Sedimentary Failure Analysis Charge-to-mass ratio UV exposure
CLC: TN405
Type: Master's thesis
Year: 2010
Downloads: 57
Quote: 0
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Abstract


Micron era , semiconductor manufacturing technology into the nanometer era , state-of-the-art semiconductor company in the world has been able to produce 32 - nanometer chips , more and more state - of - the - art technology and equipment to be introduced into the semiconductor manufacturing industry . Advanced analysis of the failure of FA constantly advanced technology development and manufacturing process , analyze yield problems encountered in the manufacturing process , to find the real cause of the problem , and proposed failure model , to solve the problem together with the productive sector , improve product yield . Detailed exposition of this thesis, the sub-micron integrated circuit manufacturing process , advanced equipment and processes , as well as equipment failure analysis principles and applications . The thesis advanced LSI manufacturing plants commonly used in failure analysis equipment types and applications . Example : scanning electron microscopy , transmission electron microscopy , the application of these technologies and means to promote the development of electronic components failure analysis techniques , the failure mechanism of research work to further deepen . The main process of the integrated circuit , and highlights the failure analysis techniques in these processes , combined with the practical experience of the authors of the paper , the typical events that occur in the integrated circuit manufacturing process equipment and failure analysis techniques , the use of failure analysis analysis process, from the cause of the incident to the essential reason for the event as well as the final solution for the entire track , and collaborative division of labor and process engineers , equipment engineers and device engineers to create the event of the failure mechanisms proposed solutions , and actual experience positive . Final completion of the failure analysis .

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Microelectronics, integrated circuit (IC) > General issues > Manufacturing process
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