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Study on the Preparation and Mechanics Properties of the Porous Low-k MSQ Material

Author: TangZuo
Tutor: HuYiFan
School: Huazhong University of Science and Technology
Course: Optics
Keywords: dielectric materials porous O-MSSQ sol-gel pore mechanical properties
CLC: TB383.4
Type: Master's thesis
Year: 2009
Downloads: 11
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Abstract


In order to satisfy the needs of modern life, the electronic products’degree of integration has been increasing,the size of components of the electric circuit have to be reduced continuously. It causes the increase of the RC detention produced by the wire resistance R and the interlayer electricity capacitance C, which has limited the high-speed performance, also increase the energy consumption.Mminimizing the dielectric constant may from one aspect effectively solve this problem. At present, the main way to reduce the dielectric constant is using the organosilicon material to replace conventional SiO2, and introducing porous structure. Our group has been engaged in researching the porous O-MSSQ materials and prepared the high porosity of the porous O-MSSQ films, its dielectric constant may reach 2.0 below. However, with increase in porosity, mechanical properties decreased. This paper focuses on the introduction of porogen volume on the mechanical properties of materials. The most important indicator to measure the mechanical properties is the elastic modulus and hardness ratio E/H.In this paper, we have prepared the porous O-MSSQ aerogels and thin films, taking theβ-cyclodextrin as a foaming agent, using the sol-gel and spin-spread method. Through a number of testing, we have systematically and comparatively studied the surface appearance, microstructure structure, thermal stability as well as mechanical properties and so on. Through the SEM test observation indicates that the surface of experimental porous O-MSSQ film is smooth, thickness uniformity, and do not have hole collapse. The nanometer indentation test shows that if the content of porogen is too much, the mechanical properties of material will be weaken. In spite of this, the average of material’s elastic modulus E is still greater than generally minimum value -- 7.0Gpa which requested to the integrated circuit’dielectric. Moreover, the test results indicate that with the increase of film thickness, its elastic modulus will further enhances. Fthe O-MSSQ porous aerogels BET test results shows the porosity of our material is in a large range of pore size distribution, pore size are not well controlled, which need further improved.

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