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Application of Plasma Technology in Pigment Dyeing

Author: SongFuJia
Tutor: ChenYing
School: Beijing Institute of Clothing Technology
Course: Textile Chemistry and Dyeing and Finishing Engineering
Keywords: Low-temperature plasma Cationic modified Cotton fabric Pigment dyeing Adhesives
CLC: TQ630.1
Type: Master's thesis
Year: 2010
Downloads: 80
Quote: 0
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Abstract


Processing cotton fabric by plasma and cationic modifier in this paper to study the impact of different pretreatment methods of pigment dyeing effect , combined with scanning electron microscopy and Langmuir probe technology , the various factors in the pretreatment process explore the analysis , pigment dyeing conditions , characterized by K / S value and color fastness level dyeing effect , determine the best process . The research results show that the cationic modified processing and low-temperature plasma treatment could improve the effect of pigment dyeing . The cationic modified optimum conditions : FK-316 dosage of modifier 5% owf, treatment temperature 75 ° C , the processing time 30min . The treatment of this condition , dyeing K / S value is high , dry rubbing fastness the soaping of 5 , 8 light fastness , wet rubbing fastness and scrub fastness rating of three or more . The low pressure plasma processing technology : oxygen plasma , power 300W, pressure 30Pa, processing time 7min . Under this condition , dyeing K / S values ​​slightly lower than the the cationic modified treatment , the color fastness of dyed fabrics and feel basically quite . The optimum conditions for atmospheric plasma treatment : double-sided air plasma treatment , power 3000W, speed 0.5m/min . Under this condition , the pigment dyeing K / S value is close to the cationic modification treatment , and the color fastness of the dyed fabric and feel very basic . The smaller particle size Imperon K series pigment dyeing performance is better than ordinary paint , the choice of 20g / L adhesive PU after curing at 120 ℃ for 3min , the color fastness of dyed fabrics and feel better .

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