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The powder metallurgy laminated prepared Cu / Al functionally gradient materials . Relative density experiments , metallurgical experiments , scanning electron microscopy morphology and composition analysis , X - ray diffraction experiments , microhardness experiments , conductivity experiments , research different repression stress , primary and secondary sintering temperature on the relative density , microhardness , conductivity and Al-Cu intermetallic compound is generated . The study found that the primary sintering the higher the temperature, the higher the relative density of the sample ; the higher the sintering temperature , an increase in the type and quantity of the Al - Cu intermetallic compound is generated , the higher microhardness ; primary sintering temperature , and secondary sintering temperature just than copper alloy eutectic temperature is the optimum temperature , then sintering to obtain higher conductivity ; component layer 6 by 500MPa a suppression , 560 ℃ primary sintering , the sample of 565 ° C for secondary sintering highest conductivity for 38.4MS / m, this process is the best process .
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