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Synthesis, Application and Characterization of a Kind of High Speed Curable Photocurable Resin

Author: HuangZhiBin
Tutor: ZhangKeDa
School: Suzhou University
Course: Applied Chemistry
Keywords: Photosensitive resin Solidify Acrylate Michael Addition
CLC: TQ320
Type: Master's thesis
Year: 2003
Downloads: 275
Quote: 0
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Abstract


The photosensitive resin is a multifaceted superiority special resin, it is from a photosensitive prepolymer, the reactive diluent and photosensitizer composition, its use is very wide, high degree of attention by the scientific workers. The photosensitive resin with energy conservation, pollution, fast curing, high production efficiency, suitable for assembly line production, etc., in recent years has been rapid development. Dendrimer and hyperbranched resin is the latest development of Polymer Science, its unique molecular structure, to give it special properties. In this paper, the diverse aliphatic amines and with multi-double bond of the acrylate synthesized by the Michael addition reaction of a class can be cured quickly hyperbranched photosensitive resin. Top photosensitive resin of the reactive diluent TMPTA and TPGDA, added directly to 30mol% of the theoretical amount of ethylene diamine (triethylenetetramine), and the reaction at room temperature (25-30 ° C) for 10 hours, so that the part of the TMPTA and TPGDA situ (insitu) generate multi-functional groups of hyperbranched photosensitive resin oligomers. By 1 HNMR integral area of ??can calculate the actual percentage of the addition reaction of the number of double bonds in the extent of reaction, TMPTA and TPGDA to 29.68mol%. Multi-double bond in the resulting product is equivalent to the fact photosensitive resin composition of 30% of the multi-double bond in the oligomer and 70% unreacted TMPTA (TPGDA), 1 HNMR and GPC analysis proved Homogeneous The oligomers, mainly includes a photosensitive resin containing 8-12 acrylate double bonds of the hyperbranched oligomer and its 2,3-mer. In 1635.8cm -1 at infrared absorption peak height changes can be seen, the acrylate double bond under UV irradiation curing. We prepared above hyperbranched photosensitive resin, corresponding to 30% Average industrially most commonly used linear bisphenol A epoxy diacrylate (604) photosensitive oligomer plus 70% TMPTA mixture, and 30 % aliphatic urethane diacrylate (244) of the photosensitive oligomer plus 70% TMPTA mixture, the ultraviolet-curable resin, the two most critical indicator - the viscosity and cure speed of comparison: The results are hyperbranched the viscosity of the photosensitive resin The other two linear resin mixture, 1/3 to 1/2, and solid-class high-speed curing photosensitive resin synthesis, characterization and application of Chinese Abstract speed 90 times faster. For explanation of the above phenomenon is: viscosity Hyperbranched photosensitive resin oligomer of the shape of the molecule is ellipsoid chainless wound, intermolecular little friction, so the viscosity of the mixture thus obtained is far less than the same molecular weight linear The photosensitive resin oligomer. Hyperbranched photosensitive resin oligomer the multiterminal group structure, the periphery of its molecules very dense high activity of the photosensitive group is an acrylate cool double bond, these double bonds highly branched structure makes it easy to participate in the polymerization reaction, and less subject to crosslinked network restrictions. Hyperbranched photosensitive resin many double bonds in its highly branched spherical surface of the structure, it is not only by intermolecular reaction, and easily by intramolecular reaction, and thus the UV curing speed, high conversion rate. Because this article by adding a small amount of ethylenediamine series fatty amines typically a reactive diluent, the reaction is stirred at room temperature for the process is simple, used directly without isolation, not substantially increase the cost, but greatly improves the performance of the product, facilitate the promotion, I believe that this method has broad prospects for development in the actual production applications.

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