Dissertation > Excellent graduate degree dissertation topics show

Preparation and Properties of Aluminum Nitride/Polyimide Nanocomposite Films with High Thermal Conductivity and Low Dielectric Permittivity

Author: HaoXiaoJing
Tutor: DangZhiMin
School: Beijing University of Chemical Technology
Course: Information materials
Keywords: nanocomposite polyimide n-AlN thermal conductivity dielectric property
CLC: TB383.2
Type: Master's thesis
Year: 2007
Downloads: 335
Quote: 1
Read: Download Dissertation

Abstract


Nowadays, the micromation is mainly one of the development aspects of printed circuit board (PCB) and the package of electronic components. The polymer-based electronic package material has been proved to be promising for use in the package of electronic components. In the actual application of the electric and electronic domain, dielectric materials require not only low dielectric permittivity but also high thermal conductivity so that they can satisfy the increasing thermal diffusion of PCB and the package of electronic components .To improve the thermal conductivity of the polyimide (PI) films, aluminum nitride nanoparticle (n-AlN) with high thermal conductivity itself was dispersed into the PI by mechanical stirring and by ball-milling with planetary mill respectively.γ-aminopropyl triethoxysilane(KH550) was used as a coupling agent for encapsulating inorganic nanoparticles. TEM、SEM、thermal constants analyzer、impedance analyzer were used to characterize the microstructures and measure the thermal and dielectric properties of the achieved A1N/PI nanocomposite films. The results showed that the de-agglomeration of the encapsulating A1N nanoparticles was clearly observed by TEM. The thermal conductivity of the film increased to 0.35 W/ m·K in comparison with thermal conductivity pure PI of 0.16 W/ m·K , while still keeping a low dielectric permittivity(ε<4) prepared by ball-milling. It was obvious that the thermal and dielectric properties of films by ball-milling are better than those of by mechanical stirring. The material is hopefully used as novel PCB and package material of electronic components.

Related Dissertations

  1. Fabricationand Properties of SiC-AlN Multiphase Ceramics Prepared by Gelcasting,TQ174.62
  2. Nano-Packaging and Processing Technology on Preservation Quality of Tea,TS272
  3. Study on the Dynamic Thermal Test Device of Sprinklers,TU892
  4. 1,4 - bis (4 - amino-2 - (trifluoromethyl) phenoxy ) benzene -type Schiff base imide copolymer synthesis and characterization,O631.3
  5. Electrically Conductive Adhesives Based on Epoxy Resins Modified by Polyimide Powder with Carboxyl Groups,TQ433.437
  6. Preparation and Characterization of Magnetic Nanocomposite Hydrogels,TB383.1
  7. The Experimental Research on Measurement of Thermal Contact Resistance of Two Contacted Solids and Thermal Conductivity,TK124
  8. Sapphire substrate material growth of high quality AlN,TN304.2
  9. A Study on the Fullerene Nanocomposites,TB383.1
  10. Pulse Nanocomposite Coatings Preparation and Properties,TQ153
  11. Functional aramid and polyimide Preparation and structural properties of,TB34
  12. Units containing bibenzimidazole polyimide synthesis , structure and properties,TQ323.7
  13. Variable conditions in orbit, the spacecraft solar wing thermal - structural analysis,V442
  14. Soluble polyimide UV coating applied research,TS195.2
  15. High thermal conductivity epoxy composites and Research,TB332
  16. Study on the Seasonal Frozen Roadbed Temperature and Deformation of Kangding Section of Sichuan-Tibet Highway,U416.1
  17. Research on Thermal Physical Parameters of Asphalt Mixture,U414
  18. The AIN film IF sputtering Preparation and bulk acoustic resonator developed,TN713
  19. 600V VDMOS power device process optimization study,TN386
  20. Experimental Investigation on Binary Nanocomposite Coatings by Electrodeposition in an Ultrasonic Field,TG174.4
  21. Effect of Surface Modification of Nano-TiO2 on the Corrosion Resistance of Polyurethane,TB383.1

CLC: > Industrial Technology > General industrial technology > Materials science and engineering > Special structural materials
© 2012 www.DissertationTopic.Net  Mobile