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Site-Selective Metallization of the Insulating Substrates

Author: YaoLiBei
Tutor: LiangLiFang; SuZuo
School: Guangxi Normal University
Course: Organic Chemistry
Keywords: Screen-Printing Flexible substrate Surface modification pattern copper silver
CLC: TB383
Type: Master's thesis
Year: 2012
Downloads: 33
Quote: 0
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Abstract


In the microelectronics industry, with the development of microelectronics andsemiconductor technology, the preparation of metal line pattern on the insulatingsubstrate becomes not only one of the key of the development of modern science andtechnology, but also a very important step of the production of the electronic, optical,mechanical devices such as monitors, biosensors and so on in recent years. There aremany methods for the preparation of metal circuit. However, with the development oflarge-scale integration of electronic devices further toward the direction ofminiaturization, it is still a huge challenge to develop some simple methods ofpreparating metal pattern.This dissertation based on the study of an extensive literature and theunderstanding of green chemistry, commits to finding a simple method of directlypattern the metal lines on the surface of the insulating substrates. The content of thisdissertation could be summarized as follows:1. The copper/silver circuit pattern was fabricated on the surface of polyimidefilm directly through site-selected modification, ion exchange, and the dimethylamineborane (DMAB) reduction by the screen printing method. The deposition process andmechanism of these copper/silver patterns were determined by the characterizationmethods of cross-sectional transmission electronic microscopy (TEM), scanningelectronic microscopy(SEM), and atomic force microscopy(AFM) and so on.2. A novel convenient method was developed for electroless copper depositionon glass material. We coated polyethylenimine (PEI) on the surface of glass substrate,and then introduced amino groups to effectively adsorb the palladiumto adsord thecatalysts that could initiate the subsequent Cu electroless plating, to prepare a copper film onto the glass substrate surface. X-ray diffraction(XRD), AFM, SEM imagescombined with energy diffraction X-ray (EDX) analysis demonstrated the successfulcopper deposition on the surface of glass substrate.3. The polymer film was treated with alkali, and then reacted with the PEI toobtain modified flexible substrate. The films were characterized by attenuated totalreflection Fourier transform infrared instrument (ATR FT-IR), cross-sectionaltransmission electronic microscopy (TEM), scanning electronic microscopy (SEM),and contact angle.

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