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Grain Orientations and Anisotropic Properties of Cu-Sn IMCs in Micro-Interconnection Solder Joints

Author: NiuLiNa
Tutor: TianYanHong
School: Harbin Institute of Technology
Course: Materials Processing Engineering
Keywords: Cu6Sn5 Grain orientation Single crystal copper Anisotropy EBSD
CLC: TG401
Type: Master's thesis
Year: 2011
Downloads: 99
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Abstract


By high-performance computing and miniaturization of electronic devices driven TSV (Through Silicon Vias, TSV) 3D package chip technology become the key technology of vertical interconnects. However, the pad size decreases TSV, solder joints caused by intermetallic compound (Intermetallic Compound, IMC) increase in the proportion and number of grains contained in the pad itself is reduced, will interface IMCs Orientation impact. And when the solder joint IMCs increased the proportion of grain and has a certain limited number of preferred orientation, the mechanical properties of solder joints will produce greater change. Therefore, more in-depth study, single crystal pads IMCs anisotropic grain orientation and performance is important. This paper Sn3.0Ag0.5Cu/Cu tiny solder joint IMCs were studied systematically. Analysis of the multi were observed first single crystal copper and Sn3.0Ag0.5Cu (SAC) solder melting at a different temperature, time, cooling rate and the aging conditions interface Cu 6 Sn 5 morphology, the effects of different forms Cu 6 Sn 5 growth kinetics; Then using electron backscatter diffraction technique (Electron Backscatter Diffraction, EBSD) combined Orientation electron microscopy imaging analysis system (Orientation Imaging Microscopy, OIM) analysis method Cu 6 Sn 5 crystal orientation relationship with the pad of a comprehensive and systematic study established Cu 6 Sn 5 morphology and orientation of the contact, and described the solder matrix internal hollow structure Cu 6 Sn 5 formation mechanism; Finally nanoindentation experiments to study the Cu 6 Sn 5 elastic and plastic anisotropy. The results showed that: solder interface Cu 6 Sn 5 morphology and pad orientation, process parameters and other factors, with the remelting temperature, Cu 6 Sn 5 by the scallop-shaped prismatic transition to the single crystal pads prismatic Cu 6 Sn 5 regular arrangement; Cu 6 Sn 5 surface of the nano-scale Ag3Sn particle formation mechanism of adsorption of active substances available theoretical explanation; polycrystalline copper pad on the Cu 6 Sn 5 grain and single crystal copper at 250 ℃ generated scallop-shaped Cu 6 Sn 5 grains having {0001} plane and weld disk into 30 ° ~ 50 ° angle orientation relationship; SAC / Cu single crystals at 300 ℃ interface rules generated prismatic Cu 6 Sn 5 grains all have {0001} planes perpendicular to the pad, {2110} planes parallel to the pad plane, lt; 0001 gt; crystal direction parallel to the Cu lt; 110 gt; crystallographic orientation relationship. This preferred orientation is due to the low degree of mismatch caused, and the orientation relationship from the effects of aging; established Cu 6 Sn 5 grain morphology and orientation of the contact between the solder matrix hollow structure Cu 6 Sn 5 formation mechanism of crystal growth can be explained Bravais law. Cu 6 Sn 5 modulus anisotropy, close-packed lt; 0001 gt; crystal elastic modulus to the maximum degree of anisotropy of up to 16.3%; Different orientations pads Cu 6 Sn 5 plastic anisotropy exists, (001) single-crystal copper interface Cu 6 Sn 5 average grain Schmid factor most strongly anisotropic, polycrystalline copper weakest.

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CLC: > Industrial Technology > Metallurgy and Metal Craft > Welding, metal cutting and metal bonding > Welding general issues > Welding Metallurgy problems
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