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Cyanate ester (CE) resin is a thermosetting resin very important, it is a unique chemical structure, given its excellent overall performance, exhibit high mechanical properties, high temperature resistance, dielectric properties excellent, low water absorption, and thus by the widespread concern, recognized as the preparation of the 21st century, high-performance structure / resin performance integrated material most competitive species \potential applications. However, as with other thermosetting resin, brittleness CE resin inevitable defects has become a \The CE research areas of focus in recent years. This problem is solved by the controlled hydrolysis of the γ-(methacryloxypropyl)-propyl trimethoxy silane (KH570), synthesized a novel hyperbranched the polysiloxane (HBPSi), using respectively HBPSi, and HBPSi and epoxy (EP) the hybrid modifier (HBPSiEP) composition to of toughening modification CE resin. The main aspects of research work carried out: HBPSi molecular structure design, preparation, and structural properties of. The use of FTIR and 1H-NMR techniques discussed its structure, studies have shown that KH570 happened hydrolysis reaction of the slightly yellow transparent liquid like hyperbranched polysiloxane. Further, the viscosity and molecular weight on the HBPSi studies show that the viscosity and molecular weight with deionized water and molar ratio of KH570 increases gradually increase. HBPSi / CE binary cured resin component design and preparation, impact of resin structure and performance of the main factors. On HBPSi modified CE resin curing process, microscopic morphology, toughness, heat resistance, dielectric properties and water absorption results show that, HBPSi can effectively improve the CE-curing process, the presence in the body of a large number of the cured resin cavity structure, reduces the rigidity of the CE resin original highly crosslinked triazine ring structure; more importantly, HBPSi / CE curable resin relatively pure CE resin has a good toughness, when The content of HBPSi is 15wt% the impact strength of the modified CE resin approximately pure CE resin 2.2 times, and the impact of cross-sectional SEM image of a large number of dimples structure; addition, modified CE resins also have excellent heat resistance, dielectric The electrical properties and low water absorption. HBPSiEP / CE Sanyuan curing resin component design and the preparation of main factors affecting the structure and properties of the resin material. Impact on the performance of the research HBPSiEP content CE curing process and ternary curing resin that The HBPSiEP not only effectively promote the curing of CE, a significant increase in the CE resin toughness, and toughness of the rate of increase is much stronger than pure EP impact on CE toughness, for example, When The content of HBPSiEP is 30wt%, HBPSiEP / CE the resin, impact strength of 23.3kJ / m ~ 2, approximately CE resin 2.5 times, however, the maximum the impact strength of the EP / CE resin approximately CE resin 2 times. Also worth mentioning is that, HBPSiEP / CE than CE resin has more excellent in bending strength, heat resistance, flame resistance, lower water absorption, while maintaining a CE original excellent dielectric properties. The subject for the first time will hyperbranched polymers introduced into CE resin modified field to overcome the major defects of the CE resin, new toughening CE resin matrix resin and electronic packaging field has a strong application potential in high-performance functional materials development and wide application of the CE resin has a very important significance. In addition, the research on this topic other toughening of thermosetting resin modified with some guidance.
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