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Creep Behavior of 63Sn-37Pb Alloy under the Electro-Mechanical Loadings

Author: XuQingLei
Tutor: XuanFuZhen
School: East China University of Science and Technology
Course: Chemical Process Equipment
Keywords: 63Sn-37Pb Creep Electric current Force - electrical coupling
CLC: TN305.94
Type: Master's thesis
Year: 2010
Downloads: 43
Quote: 1
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Abstract


Solder solder 63Sn-37Pb widely used in electronic packaging and electronic products , the performance and reliability of their service is critical to the quality of the package structure . People over the past few decades, a lot of research on the creep properties of solder solder , however, confined mainly to mechanical loads , failure of the current impact and coupling effects attention . With the development of electronic packaging solder to the sub-micron scale solder solder current density will greatly enhance the current effect is more prominent force - electric coupling solder solder failure behavior and the law will have a very important practical and theoretical value . In this paper, the electronic package with solder 63Sn-37Pb solder object , system the creep performance tests carried out under force - electrical coupling , focusing on the impact of the current 63Sn-37Pb creep exponent and creep activation energy . The research topics include : 63Sn-37Pb tensile creep test ; force - electric coupling solder solder solder solder creep behavior based on numerical speckle correlation calculated real-time monitoring ; force - electrical coupling solder solder microstructure evolution . The results show that : - electrically coupling action of application of the force , and the solder brazing material 63Sn-37Pb creep index will be reduced as the current increases , the creep activation energy is increased as the current increases ; current is applied to promote the the solder solder creep folds texture of initiation , leading to the initiation shortened and texture density increases , indicating that the current accelerated creep deformation ; microstructure analysis showed , the current caused by the soldering solder local tin element directional migration occurred , form a staggered distribution of lead - poor area and lead-rich area , change the microstructure , so that the creep deformation easier ; current Joule heating , while promoting the electron mobility , thus speeding up the 63Sn-37Pb spread between atoms lead to creep transformation strain rate increased.

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Semiconductor technology > General issues > The semiconductor device manufacturing process and equipment > Packaging and cooling issues
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