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Damp heat load of lead-free solder joint resistance strain

Author: ZhouZuXi
Tutor: JiangLi
School: Central South University
Course: Electronic Science and Technology
Keywords: SnAgCu solder joints Resistance strain Five - probe differential method Metal corrosion
CLC: TN05
Type: Master's thesis
Year: 2010
Downloads: 129
Quote: 0
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Abstract


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CLC: > Industrial Technology > Radio electronics, telecommunications technology > General issues > Manufacturing processes and equipment
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