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Parameter Optimization of Ultra-Fine-Pitch Wire Bonding Process

Author: MoZhuoYa
Tutor: LouYunJiang
School: Harbin Institute of Technology
Course: Mechanical and Electronic Engineering
Keywords: IC Semiconductors Packaging Industry Wire Bonding Ball Shearing Test Wire Pulling Test Taguchi Method
CLC: TG43
Type: Master's thesis
Year: 2008
Downloads: 46
Quote: 1
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Abstract


In the semi-conductor technology industry, the high density and high pin-count IC are required. Following this trend, the wire bonding manufacturing process of the assembly goes toward to the high precision wire bonding technology with fine pitch bonding. So the author hope to improve reliability of the wire bonding process for ultra-fine-pitch gold wire bonder.Firstly, the author introduced three kinds of bonding technologies and in this thesis, the author took thermosonic (TS) ball bonding for example. Additionally, the author introduced the whole process of ball bonding. According to the characteristic of ball bonding, there are three test to control bonding quality and reliability——wire pull test, ball shear test and SEM test.Secondly, the author used Taguchi method to deal with multi factors and multi levels and there are two important tools for Taguchi method. They are signal to noise ratio and orthogonal array. From the signal to noise ratio, the author can get which factor affect the response mostly by setting the target and from the orthogonal array, the author can get the parameter optimization .Thirdly, the author used four experiments in the thesis. The first one is observation on the transformation of ball shearing force before and after wire pulling test. The second one is FAB size control by Taguchi method. The third one is different loop shapes forming by different wire loop process parameters setting and the last one is optimization of wire bonding process parameters setting.Finally, the results of each experiment are integrated applied to get the parameter optimization which are applied in the wire bonder ParalleX Sharp of ParalleX Precision Co., Ltd. So the parameter optimization of ultra-fine-pitch gold wire bonding process is useful and helpful for equipments manufacturers.

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CLC: > Industrial Technology > Metallurgy and Metal Craft > Welding, metal cutting and metal bonding > Welding equipment
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