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The Study on Reactive Wettability of SnAgCu Solder Alloy on Au/NiFe/Cu PAD

Author: LiXueTao
Tutor: LiMingYu
School: Harbin Institute of Technology
Course: Materials Physics and Chemistry
Keywords: Moist Proliferation IMC evolution The diffusion barrier layer Pd
CLC: TG425
Type: Master's thesis
Year: 2009
Downloads: 49
Quote: 0
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Abstract


This article is based on experiments Au / NiFe / CuUBM coating process on the wettability of Sn-Ag-Cu solder pad UBM layer nickel diffusion mechanism combined with the diffusion theory analysis . Blocking the Ni diffusion explore pad UBM plating a diffusion barrier layer Pd wetting and solder joint reliability . This study mainly includes the following aspects: (1 ) for the actual production of poor wetting phenomena , evaluated the wetting properties of the five groups of pads ; test results show that the the UBM layer of nickel, copper and diffusion of atoms to the pads surface oxidation is the main reason of poor wetting ; analyzed UBM layer production process impact gold grain shape , size , thus affecting the diffusion of Ni, Cu ; combination of wettability on pad UBM layer process parameters were optimized ; ( 2 ) theoretical analysis shows that the pad UBM plating of Ni atoms mainly grain boundary diffusion ; 180 ° C / 24 hours is calculated according to the statistical diffusion theory with experimental results , 160 ° C / 24 hrs , 160 ° C / 48 hrs Ni atoms in the UBM gold layer of the grain boundary diffusion coefficient and diffusion distance ; ( 3) study the solder joints after thermal shock cycles vertical side IMC evolution ; solder joint thrust intensity value with the variation of the thermal cycle , and summarizes the fracture location evolution ; diffusion barrier layer (4) of the pad in the UBM was added Pd solder wet spread good; experimental results show that Pd having a barrier effect of the diffusion of atoms of Ni, Cu , Pd atoms will affect the grain morphology of the UBM layer and size , so that the sputtering gold layer and the gold plating layer stars interface disappears ; accelerate the generation of the crack and the crack of the solder vertical side hole (5) the effects of aging , so that the brazing material peeled off ; the pad thrust testing results show that after aging , the presence of a Pd element conducive to enhance the binding force between the intermetallic compound , so that the average thrust of intensity values ??gentler and decreases with increasing aging period .

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CLC: > Industrial Technology > Metallurgy and Metal Craft > Welding, metal cutting and metal bonding > Welding materials > Brazing materials
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