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Simulated Analysis of Film Substratum Bonding Strength on Laser Scratching Test

Author: TangCuiPing
Tutor: ZhouJianZhong
School: Jiangsu University
Course: Mechanical and Electronic Engineering
Keywords: Laser scarification Film Bonding strength Numerical Simulation
CLC: O484
Type: Master's thesis
Year: 2007
Downloads: 28
Quote: 0
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Abstract


The film based interface bonding strength is the characterization of the important indicators of the quality of the film, is a key technology in the research and application of thin film technology. The infrared laser quasi-static scratches Law is a non-contact measuring hard film matrix interface bonding strength of new testing methods. Its principle is the use of the long-pulse laser quasi static loading the surface of the film of the coating specimens, debonding and film damage caused by the film and the substrate, while the workpiece relative to the laser do feed movement, the laser parameters in the interface destruction of the film base binding assay parameters and material properties of the film base parameters to characterize the binding strength of the interface. Firstly, the the laser scratch test method characterization of thin film coating interfacial bond strength of principle, method and process analysis. Established according to the loaded laser process parameters and material properties of the film substrate, based on the Fourier heat conduction equation, the finite element model of the film and the substrate, temperature and stress field of membrane-based systems formula. Fixed laser source and mobile laser source quasi-static loading film surface temperature field were finite element simulation of membrane-based systems combined with the time changes in the relationship as well as the film interface temperature at the heat law. According to the film and the base body of the thermal expansion of the performance, the quasi-static conditions under the thermal flexibility of this constitutive equation based on the strain displacement relations and stress balance relationship, the film and the base body of the stress field simulation, to obtain a film-based system of the stress field with time changes in relationship, and the critical point at a temperature, stress curve. Based on linear elastic fracture mechanics and elastic-plastic fracture theory, using ANSYS finite element analysis software, select the membrane-binding interface the stress greater danger point at the crack tip unit intensity factor and the J-integral calculation. The results show that: the laser during the loading process, the temperature field in the film and the substrate is increased with increasing time and temperature difference between the film and the base body. On the film surface in the stress field generated by the membrane-based system is compressive stress, the generated stress at the interfacial bonding of the film base. With the laser energy density increases, the stress intensity factor increases, the stress intensity factor also increases the film thickness increases. The simulation and experimental results are compared to film and substrate in the stress field theoretical calculations and experimental results, although there is a certain degree of error, but qualitatively reflects the variation of the film and the substrate temperature and thermal stress. The research results provides a theoretical basis for the analysis of the role of the Laser scarification process, the process is of great significance to study film-based system fails.

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CLC: > Mathematical sciences and chemical > Physics > Solid State Physics > Thin Film Physics
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