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Microelectronics Packaging silver nanowires sintered conductive adhesive Preparation and Research

Author: ZhangZhongXian
Tutor: XiaoZuo
School: Fudan University
Course: Materials Science
Keywords: Conductive adhesive Silver nanowires Sintering Solidify Resistivity Surface treatment Organic dicarboxylic acid
CLC: TB383.1
Type: Master's thesis
Year: 2010
Downloads: 430
Quote: 2
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Abstract


In recent years, nano-materials, due to its unique electrical, mechanical, optical, magnetic and chemical properties and attracting more and more interest of researchers, while the nano-conductive adhesives have also been widespread concern. With the development of nanotechnology, nano-metals with the sintering temperature significantly lower than the melting point of the metal sintering of the original features been applied to the field of microelectronic packaging, such as preparing a sintered conductive adhesive. The unique properties of nanomaterials is not only related to the size and the material itself, but also closely related to its dimension, especially one-dimensional materials such as nanowires has become a research hotspot in recent academia. Based on the silver surface treatment studies have found that using organic dibasic acid ethanol solution treated micron silver conductive adhesive film prepared with untreated micron silver conductive adhesive sheet prepared compared conductivity can be increased 4-6 times, which glutaric acid and adipic best improvement. Results can be seen by thermal analysis, about 1.4% of glutaric acid adsorbed on the silver surface protection which is not oxidized, and is heated to 150 ℃ desorption begins. This paper also uses a step polyol process successfully synthesized a diameter of about 50nm, and as its aspect ratio is about 20-40 silver nanowires. Through the silver nanowires surface treatment and Sintering Behavior of results: After glutaric acid treated nano-silver wire began to appear at 200 ℃ sintering phenomenon, and as the temperature rises, the sintering phenomenon is more pronounced, dispersed in the ring epoxy resin in silver nanowires at 200 ℃ sintering still observed phenomena; Raman testing and thermal analysis showed that the sintering behavior of silver nanowires with glutaric acid associated surface adsorption and desorption. Finally, the use of silver nanowires sintering of silver nanowires sintered conductive adhesive in the nanometer and micrometer silver wire silver sheet filler content of 75%, 300 ℃ curing conditions, the resistivity values ??as low as 5.8 × 10-6Ω · cm very close to the volume percentage of silver conductive adhesive bulk resistivity of -4.3 × 10-6Ω · cm, which was mainly due to silver nanowires sintering at high temperatures, the conductive network is formed in the resin, reducing the conductive adhesive filler The contact resistance between;, and under the same conditions, silver nanowires prepared resistivity conductive adhesive prepared nanodrugs silver particles of conductive adhesive lower resistivity values. The paper of nano silver wire surface treatment and the sintering behavior and successfully be utilized in the preparation process of the conductive adhesive, by a variety of process conditions and curing conditions of exploration and selection of successfully prepared conductivity Excellent (lt; 5 × 10-5Ω · cm) of silver nanowires sintered conductive adhesive, and were characterized by the conductive adhesive for the future direction for the study and performance optimization of conductive adhesive provides a reference for ideas, such as further reducing size of nanoparticles which can reduce the curing temperature of the conductive adhesive, a conductive adhesive used in the field of low-temperature sintering; or polyimide ester, cyanate ester resin to improve high-temperature conductive adhesive formulations to provide high temperature curing conductive nano sintered plastic; used for the metal more easily decomposed organic substrate, an organic substance decomposition of volatile metal sintered and a metal connector to achieve; the sintering of nanoparticles is applied to a wider field of integrated circuits, such as the use of nanoparticles in the sintering properties and its high line resolution can be applied to the printed circuit, inkjet printing and so on.

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