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Now electronic product has been involved into all aspects of people’s life, following with the development of electronic industry, the function and complexity of electronic product is enhanced, and the power exhaust is bigger and bigger, the thermal flow density is going up sharply, result in the temperature of product and component increases rapidly. In electronic industry, if environment temperature increases every 10 centigrade, normally the failure rate will increase one ten times, badly impact the product reliability, in some production, aviation or military field, the product failure could bring huge disaster. Use appropriate method and technology for the thermal design for electronic product, to control the product work in safe temperature, which is one of major method to ensure electronic product reliability, is being paid regard broadly.G company is one multinational company which provide designing and manufacturing automotive control product, PLC as one major product. PLC is directly applied in industry environment, required to be much higher capability in environment flexibility, interference resistance and broad application fields, result in a critical requirement in thermal reliability. In 2008, China engineering team was founded in Shanghai, how to ensure thermal design meet reliability requirement, how to speed up team grow, how to improve technology development and management capability, these issues the company has need resolved urgently.Six sigma has become one of most influencing management method with the notion of continuous pursing excellent quality, is matching well with the management notion of the company, naturally it was introduced into the product development process. Summarized the content and function of Six Sigma management, introduced this PLC application, the content and basic principle of thermal design. Combined with the actual situation of the company and the characteristic of this electronic product, applied DFSS, started from customer’s expectation, identified product thermal design specification and critical factors to thermal reliability, set up and analyzed the measure system, developed conceptual design, statistical reliability analysis and risk analysis, modeling, designing and optimizing for component level, PCB level and system level, passed verification finally, met design expectation of thermal reliability.This article studied and practiced DFSS application for the company thermal design, set up scientific and normative process and method for thermal design, make the thermal design more precise and trusty, product development cycle and test cost got effectively control. Not only the company benefits from more reliable quality, also provide positive reference for the whole industry to use Six Sigma management.
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