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Research on Preparation and Property of Glass Binder for Thick-film Metallization

Author: ShuaiRenZhong
Tutor: YangDeAn
School: Tianjin University
Course: Materials Science
Keywords: Dielectric properties Wettability Coefficient of thermal expansion Thermal shock resistance
CLC: TG492
Type: Master's thesis
Year: 2010
Downloads: 65
Quote: 0
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Abstract


The main purpose of the experiment is designed different glass formulations, having different thermal expansion coefficients of the glass powder , so that between the glass binder can be applied to the metallization process well with the metal conductor and the substrate was prepared under the high temperature melting conditions thermal matching each other . Milling wet mixing , high temperature melting , screen printing and low temperature firing thick film preparation process for technical features , XRD, SEM and other analytical tools . Studied the preparation process of the glass , the glass composition on the firing temperature , dielectric properties , wettability , and stability of the use of the thermal shock resistance test of the printed layer . First, the analysis of the sintering properties of the glass in the different sintering temperatures , changes in the dielectric properties, porosity, water absorption . Meanwhile, the analysis of the impact of the additive on the above properties . An alkaline earth metal oxide and ZnO added to help reduce the glass transition temperature , and promote densification sintering , but increases the dielectric loss of the glass ; Al2O3 added to suppress the phase separation of the glass and increase the crystallization temperature of the glass , and the coefficient of thermal expansion of the glass can be adjusted to maintain the stability of the glass . Secondly, we explore the wetting of the glass frit and the AlN substrate . Ensure that the adhesion strength between the two is the strength of the glass itself , needs the wetting behavior of the glass of the Institute of preparation system . Was found that the ZnO-containing glass , although very good wettability of the substrate , but the metal sintering temperature under a severe phase separation ; containing BaO glass , the effect is relatively good , although there is a small amount of crystals were precipitated , but to the base by penetrating sheet grain boundaries can enhance the adhesion strength. Finally, the study of the thermal properties of the glass . The coefficient of thermal expansion of the glass depends on the glass structure of the connection , the thermal expansion is mainly affected by the interaction between the cation of the glass and the non-bridging oxygen . Body from the outside network off network , the structure becomes loose , increasing the coefficient of thermal expansion ; the glass contain more Zn2 can enter from the middle of the glass network of off network . Was found in the thermal shock resistance of the experiment , the coefficient of thermal expansion of the glass binder and the substrate is the closer, and the connections between them more stable .

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CLC: > Industrial Technology > Metallurgy and Metal Craft > Welding, metal cutting and metal bonding > Bonding, the bonding > Bonding material
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