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Research on the Heat and Moisture Resistance of Novel Epoxy Resin Systems

Author: XuYuanHua
Tutor: SuShengPei
School: Hunan Normal University
Course: Polymer Chemistry and Physics
Keywords: epoxy resin polymerically-modified clay composites curing process heat resistance and moisture resistance
CLC: TQ323.6
Type: Master's thesis
Year: 2011
Downloads: 103
Quote: 1
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Abstract


Bisphenol A epoxy resin is a universal resin which has disadvantages in terms of heat and moisture resistance in the electrical and electronic applications. In this paper, two methods, introducing the hydrophobic and bulky cyclohexyl into the structural frame of epoxy resin and adding the active polymerically-modified clay to prepare the epoxy/clay composites, were used to improve the heat and moisture resistance of epoxy resin systems. Details are as follows:A bisphenol epoxy resin prepolymer (DMBPCEP) was synthesized by the reaction of 1,1-bis(4-hydroxy-3-methylphenyl)-cyclohexane (DMBPC) with epichlorohydrin (ECH) in the presence of sodium hydroxide. The structure of DMBPCEP was characterized by FT-IR, NMR and GPC. The result from HC1-acetone method showed that the epoxy value of DMBPCEP was 0.47mol/100g. The curing behaviors of the epoxy system consisting of DMBPCEP and 4,4’-diaminodiphenyl-methane(DDM) as the curing agent were investigated using differential scanning calorimeter (DSC), and the thermal properties of obtained cured products were examined by DSC, HDT and TGA. The water absorption was also compared with that of the bisphenol A epoxy resin (E-44). The calculated results from DSC data showed that the value of the activation energy (Ea) and the curing reaction order (n) is respectively 49.8 kJ/mol and 0.87. DSC, HDT and TGA analyses and the moisture absorption experimental results showed that Tg, HDT and T10% of DMBPCEP/DDM cured product was respectively 171.7℃,160.7℃and 377.6℃and the water absorption was 0.32%, indicating that the thermal and water absorption properties of this epoxy resin are all superior to those of E-44.Polymerically-modified clays including polystyrene-co-methyl acrylate modified clay (PSMA-clay) and polystyrene-co-acrylic acid modified clay (PSAA-clay) were prepared by cation exchange and used to prepare E-44/clay composites. The curing reaction of E-44/clay composites was investigated using DSC and FT-IR. DSC and FT-IR analyses demonstrated that there is a reaction between epoxy groups and carboxylic acid groups besides the curing reactions between epoxy groups and the curing agent, DDM for E-44/PSAA-clay composites. TEM results indicated that PSAA-clay was dispersed well in the E-44/PSAA-clay composites. Improved thermal and moisture resistance properties due to the addition of reactive clay were also achieved for E-44/PSAA-clay composites.The viscosity of E-44/clay composites increased with the addition of pristine clay or polymerically-modified clay, which caused to the difficulty of the process and the degassing. Therefore, the E-44/CD-1180/clay composites were prepared by mixing E-44, CD-1180 and clay and their heat and moisture resistance properties were also studied. It is found that the mobility of E-44 increased due to the addition of CD-1180 with low viscosity. Compared with E-44/CD-1180 system, Tg and HDT of E-44/CD-1180/clay composites were all improved. When 3% clay was added, Tg of E-44/CD-1180/PSAA-clay composite, E-44/CD-1180/PSMA-clay composite and E-44/CD-1180/MMT were respectively improved 10.3℃,5.4℃and 4.3℃compared with that of the E-44/CD-1180, HDT was improved respectively 7.2℃,5.7℃and 5.2℃, while the water absorption increased.

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CLC: > Industrial Technology > Chemical Industry > Synthetic resins and plastics industry > Polycondensation resin and plastic > Polyamide resin and plastic
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