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Advanced EFA electrical failure analysis the positioning technology PFA physical verification technology research

Author: ZhangTao
Tutor: JiangYuLong；LinTianHui
School: Fudan University
Course: Electronics and Communication Engineering
Keywords: Failure Analysis ( Failure Analysis ) Light-emitting microscopy ( PEM ) Of light induced resistivity zone ( an OBIRCH ) Passive voltage contrast ( PVC ) Electrical failure location analysis ( EFA ) Physical verification analysis ( PFA )
CLC: TN407
Type: Master's thesis
Year: 2011
Downloads: 50
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Abstract


With the continuous development of large-scale integrated circuits, the line width of declining, increasing integration, unusual for an integrated circuit device failure analysis (Failure Analysis) is becoming increasingly important, has become increasingly difficult. Thus in modern IC failure analysis field, and in the hundreds of thousands of transistors in how quickly and accurately positioning VALID becomes a very important issue. This paper focuses on the following three industry state-of-the-art electrical failure analysis (EFA) positioning technology: (1) the principle of PEM (light microscopy) the IC single components failure positioning technology; (2) OBIRCH (light-induced change in resistivity) principle the IC metallization system VALID positioning technology; (3) the use of PVC (passive voltage contrast) abnormal positioning technology principle of the channel and the GOI. With fast and accurate EFA electrical failure analysis positioning method, only the surface of the device to detect the electrical outliers, If you do not have a valid PFA physical failure authentication, still can not pinpoint the point of failure to appear in integrated circuit technology which layer can not find the cause of the problem, can not for the technology sector and suggestions for improvement, failure analysis of the effect will be greatly reduced. So another focus of this paper is to discuss how to quickly and efficiently identify the physical point of failure, including the use of physical verification of the following PFA means: chemical and hand-grinding stripping layer technology (Delayer) designated cutting technology; focused particle beam (FIB) ; abnormal the GOI layer of gate oxide the investigation technology (KOH); substrate bit wrong TEM sample preparation and observation techniques (TEM). This article will through the use of a large number of actual cases, from the EFA electrical positioning to PFA physical verification method description, reference failure analysis counterparts. In addition, the most advanced EFA technology research, including: the back of the EMMI technology wood, EMMI OBIRCH of flexible conversion recommend outliers MCT technology and InGaAs technology came into being, in order to detect the wavelength greater than 1000 nm electroluminescence , so that readers have a comprehensive understanding of the current EFA positioning technology. The last chapter of the entire wafer Level Failure Analysis Technology Summary and summarized under the new situation EFA positioning technology challenges described, the authors hope to put my many years of project failure analysis case and experience accumulated with the industry or other semiconductor microelectronics readers to share their experiences, to enhance China's large-scale integrated circuit failure analysis of the level of contribution to a force.

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Microelectronics, integrated circuit (IC) > General issues > Testing and inspection
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