Dissertation > Excellent graduate degree dissertation topics show

Finite Element Analysis on Thermal Reliability of Electronic Packaging

Author: XuLongTan
Tutor: TanHePing
School: Harbin Institute of Technology
Course: Engineering Thermophysics
Keywords: electronic packaging finite element multichip modules QFP warpage thermal stress and strain optimization
CLC: TN405
Type: Master's thesis
Year: 2007
Downloads: 1037
Quote: 8
Read: Download Dissertation

Abstract


In modern microelectronic industries, on the one hand, the developing trend of the microelectronic packaging technology is to make it not only be lignter, thiner, smaller and shorter in size but also be higher density, higher performance and lower cost; on the other hand, the microelectronic products have been widely applied in automobile industries, aeronautics and astronantics, telecommunication industries, etc. Their working circumstance is in badness, higher temperature and pooer heat dissipation. Thus, the reliability of the microelectronic packaging is getting more and more important, so we believe that the reliability research of the microelectronic packaging will play an important role in the future. In my paper, three main aspects were simulated and analyzed with the ANSYS software and FEA simulation. (1) The thermo-fluid coupling simulation analysis in microelectronic packaging, using MCM as research model. (2) The finite element analysis of microelectronic packaging structures under thermal cycling load, base on the theory of heat exchange, thermal elasticity mechanics and structural optimization, this paper presents the numerical simulation of the typical packaging stuctures, with emphasis on the package warpage, thermal stress and the reliability of the solder joint. (3) Base on the former analysis, thermal and thermo-mechanical characterization was developed to optimize the geometric parameters and material properties of microelectronic package.The thermo-fluid coupling simulation of a certain multichip module with liquid indirect cooling(water cold plate cooling) had been carried out using computational fluid mechanics module: ANSYS/FLOTRAN. The temperature distribution of the MCM and the flow visualization in the water cold plate were simulated and analyzed. Using APDL, I got the relationship between velocity of air and chip top temperature, and the relationship between velocity of inlet and chip top temperature. Compared with the traditional MCM using natural cooling, or heat sink cooling, it well increased the heat dissipation capability of package modules.In the microelectronic packaging, the reliability of the solder joint has been being a forward position and a hot topic. Due to the structural complications and miniaturization of the solder joint as well as device to available measuring instrumentation and experimental methods of acceptable accuracy, therefore, the direct measurement of the stress and strain of the solder joint in thermal cycle loading is not a straightforward task. Thus, the use of appropriate modeling methods and analytical tool is recommended to provide the solutions for the thermal stress and strain problems of the solder joint, which is an important way to assess the reliability of the solder joint. In this paper, based on the unified viscoplastic Anand model with the single internal variable—the deformation resistance, the viscoplastic deformation behavior of SnPb solder joint was described by use of ANSYS software and FEA simulation, the distribution of the stress and strain in compound SnPb solder joint during thermal cycling loading was derived. Through the simulation and analysis, the creep, stress relaxation of the compound SnPb solder joint, and the phenomena of temperature click pulley were observed.The optimization of the geometric parameters and material properties of multichip modules was carried out based on the former analysis by using the APDL commercial software ANSYS programming technique. Design variable was analyzed to the effect of thermo-mechanical characterizations. The results showed that the lesser elasticity module and coefficient of thermal expansion could availably reduce thermal stress, and the main factors affecting the package warpage and the solder joint reliability were the substrate thickness and the die thickness.So FEM numerical simulation technique is feasible and effectual in the electronic package design. The results are expected to act as database for improving reliability of package and optimized design.

Related Dissertations

  1. Research on the Mainframe System of Powder Mixed EDM and the Craft Experiment,TG661
  2. EDM Electrode Wear Mechanism and Control Research,TG661
  3. Research on the Structure and Characteristics of Permanent Magnetic Coupling,TH139
  4. Development of the Platform for Compressor Optimization Design and Aerodynamic Optimization Design in the Transonic Compressor,TH45
  5. Finite Element Analysis and Structure Optimal Design for Combined Seal at Normal Temperature and Low Temperature,TH136
  6. Investigation of Turbine S2 Stream Surface Direct Problem Aerodynamic Optimization Design,V235.11
  7. Simulation Analysis on Temperature Stress of RCC Arch Dam and Its Construction Joints Design Research,TV642.2
  8. Reseach on Optimal Control of Elevator Group Based upon Ant Colony Algorithm,TU857
  9. Based on Nonliner Finite Element Analysis of the Infilled Wall Frame Structure,TU323.5
  10. Research on High Efficiency Interior Permanent Magnet Synchronous Motor,TM341
  11. Application of Interior-Point Theory for Reactive Power Optimization in Large Power Systems,TM714.3
  12. The Basic Research of Axial Flux Inductor Type High Temperature Superconducting Motor,TM37
  13. The Optimization of AVS Video Decoder on the PC Platform and Improvement of Field Decoding,TN919.81
  14. Research on Stability of Hierarchical Sattellite Network,TN927.23
  15. Query Processing and Optimization in Massive Multi-Database Integration,TP311.13
  16. Research on Feature Extraction and Classification of Tongue Shape and Tooth-Marked Tongue in TCM Tongue Diagnosis,TP391.41
  17. Studies on Fermentation Optimization, Purification and Enzyme Characteristics of Lipase from Aspergillus Oryzae FS-1,TQ925.6
  18. Large the Hongshan iron ore mine personnel tracking positioning system optimization study,TN929.5
  19. Computing Minimum Distance between Curves/Surfaces Based on PSO Algorithm,O182
  20. Analysis of Nutritional Compositions and Quality of Shishen (Eremurus Chinensis Fedtsch.),S647
  21. 1 - deoxynojirimycin synthetic route design and process optimization,TQ463.5

CLC: > Industrial Technology > Radio electronics, telecommunications technology > Microelectronics, integrated circuit (IC) > General issues > Manufacturing process
© 2012 www.DissertationTopic.Net  Mobile