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Research on the Key Technology of MEMS Vacuum Packaging

Author: YangJunBo
Tutor: LuoXin;WangXueFang
School: Huazhong University of Science and Technology
Course: Mechanical and Electronic Engineering
Keywords: MEMS Vacuum packaging Vacuum sealing cap Anodic bonding Gold - silicon bond
CLC: TH703
Type: Master's thesis
Year: 2005
Downloads: 760
Quote: 6
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CLC: > Industrial Technology > Machinery and Instrument Industry > Instruments, meters > General issues > Structure
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