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Thermal Insulation Board’s Bonding Analysis of External Insulation of Exterior Wall

Author: ZhangLinFeng
Tutor: ZhaoTong；LiZhiGuo
School: Tianjin University
Course: Structural Engineering
Keywords: Exterior insulation Binder Bond strength Adhesively Insulation layer Insulation board
CLC: TU761.12
Type: Master's thesis
Year: 2004
Downloads: 295
Quote: 4
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Abstract


China 's energy conservation efforts , focus on building energy efficiency . The promotion of the outer wall insulation is the key to building the third step of the energy-saving . Engineering quality problems of exterior wall , the shedding of the insulation layer and the structure layer accounted for the majority . The traditional view that the bond strength is not enough reason . Traditional bond just based on experience , to ensure the bond area furnished the adhesive applicator down about 30% of the premise , and little theoretical basis . Study the insulation layer and the structure layer bonding problem , determine the bond , insulation layer does not fall off , and the promotion of external wall insulation , building energy conservation work carried out is of great significance . Proceed from the main component of the binder , and the analysis of the principle of the binder adhesive , the bond strength of the influencing factors, to give the bond strength . Under the conditions of the one hand , by a relatively large elastic modulus XPS board in the wind suction load changes and boundary constraints , is deformed in the thickness direction of the research and found that in the case of the large deformation , the adhesive layer debonding causing insulation board shedding. On the other hand , through the bond strength analysis , found that only requires less than 1% of the bond area . The resulting bonding mode based on the deformation along the thickness of the insulation board adhesive insulation board play a role in the conclusion of the boundary constraint . Therefore, to continuously adjust the bonding manner , control of the maximum deformation of the insulation board in the thickness direction , it can determine the bonding manner . The paper also stressed the importance of the construction . The insulation board Collage sew processing ensure the bonding effect is to ensure that the the insulation plate boundary constraints , thus ensuring the insulation board does not fall off .

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CLC: > Industrial Technology > Building Science > Construction > The project and the type of work > Technology of special construction works > Protection works > Insulation, insulation works
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