About 12 item dissertation in line with Stress migration query results,the following is 1 to 50(Search took 0.076 seconds)

  1. Finite Element Simulation Analysis for Copper Interconnect Reliability,PengJie/Xi'an University of Electronic Science and Technology,0/63
  2. The Analysis and Research of Cu Interconnection Failure,HanJunWu/Xi'an University of Electronic Science and Technology,0/106
  3. Non-linear Damage Mechanics Theory of Coupled Fluid-Solid with Numerical Analysis of Geo-Materials,XueXinHua/Zhejiang University,3/862
  4. Coupled Mechanical/Electrical Failure in Thin Film Interconnects under Electromigration,ZhaoZhiJun/Tsinghua University,2/203
  5. Failure Mechanism and Reliability Analysis of Cu Interconnect Structures under Thermal Stress,LinXiaoLing/South China University of Technology,0/30
  6. Coble Creep in Polycrystalline Materials Induced by Stress and Electromigration,DongYan/Shanghai Jiaotong University,1/59
  7. The Study on the Reliability of the Copper Interconnection in ULSI,LuZhenJun/Beijing University of Technology,2/229
  8. Cu / low- k interconnect system reliability study,LiuJing/Xi'an University of Electronic Science and Technology,3/269
  9. Research on Reliability of Cu Interconnect Structures Under Thermal Stress,ShuTaoLin/South China University of Technology,0/32
  10. The Evolution of Intragranular Microcraks Induced by Electromigration and Stress,BianBaoLong/Nanjing University of Aeronautics and Astronautics,1/25
  11. The manufacturing process of the UDSM aluminum interconnect line through-hole stress migration reliability,LiuYu/Fudan University,0/18
  12. Research on Si3N4 Hillock Defect in Damascene Technology of Copper Interconnect,GuiPeng/Shanghai Jiaotong University,0/51

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