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Studies on Structure and Performance of Polypropylene Modified with Waste PCB Powder

Author: ChenJiZun
Tutor: HeHui
School: South China University of Technology
Course: Materials Processing Engineering
Keywords: Waste printed circuit boards non-metal powder (Waste PCB powder) Polypropylene Wood-Plastic composites Aging Oxidation induction time
CLC: TB332
Type: Master's thesis
Year: 2013
Downloads: 19
Quote: 0
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Abstract


With the rapid development of electronic information industry, electronic wastes hasbecome a global environmental issues.The recycling of nonmetal powders of waste printedcircuit board (waste PCB powder) is the effective use of resources, it accords with thedevelopment requirements of low-carbon and sustainable economic. And wood plasticcomposite (WPC) is the new composite materials and booming development at home andabroad in recent years, it can replace some wood products, and protect the forest resources.This subject takes PCB powder and wood powder to modify polypropylene, and research thepreparation of high-performance polypropylene wood plastic composite. Study the affect oftwo fillers on polypropylene mechanical properties, thermal stability, crystalline properties,flame resistance properties, using the oxidation induction time and thermal oxygen aging tostudy the aging properties of composite material，using acid and alkali to treat PCB powderand utilizing antioxidants to improve the weather resisting properties of composite material.First，taking waste PCB powder and wood powder to modify polypropylene, the researchresults show that two fillers can take heterogeneous nucleation effect on polypropylene,increase the degree of crystallinity, accelerate the crystallization rate, greatly improved thevicat temperature, and improve the UV aging resistance of PP material. The improvement ofwaste PCB powder on toughening and reinforcing, processing performance and thermalstability of polypropylene is better than wood powder.The improvement of wood powder onthe crystallization performance, thermal performance and thermal oxygen aging ofpolypropylene is better than the waste PCB powder. Common use waste PCB powder andwood powder, can make good improvement for the comprehensive performance of PPcomposite materials。Common use waste PCB powder and wood powder to modify PP, andwhen the proportioning of PCB/WF is2:1, the comprehensive performance of compositematerials is better.Using50wt%of PCB/WF powder(proportioning is2:1), and add15wt%of the APP, thehorizontal vertical combustion of composite material can reach UL-94V-0level, limit oxygen index can reach28.5.Wood powder has into carbon effect. Common use waste PCB powderand wood powder can inhibit APP spray frost from PP composites.Through the oxidation induction time and thermo-oxidative accelerated agingexperiment, it shows that the residual copper in the PCB powder accelerated thethermo-oxidative of polypropylene. In this study, experiment use acid and alkali to treat PCBpowder. The experiment results show that the effect on eliminating the residual copper in thePCB powder of acid treatment is better than alkali treatment. Using orthogonal experiment,we come up with the optimum conditions for sulfuric acid/hydrogen peroxide treating PCBpowder: processing temperature is40℃, the processing time is4hours, sulfuric acidconcentration is5%, the dosage of hydrogen peroxide is40ml/L. PCB powder deal withsulfuric acid/hydrogen peroxide can improve the thermal oxygen aging resistance of PPcomposites.Utilizing the synergistic effect of antioxidants and metal deactivators to improve thethermal oxidative aging properties of PP composite Antioxidant1010and metal deactivatorsMD1024has a synergistic effect, can improve the Oxidation induction time（OIT），thermalstability, thermal oxidative aging properties, UV aging performance of PP/PCB compositematerials. When the proportioning of MD1024/1010is0.2:0.4wt%, the OIT of composite islongest, can reach118.7min.. After thermal oxidative aging at120℃for15days, UV aging at50℃for15days，the performance of PP/PCB composites with antioxidants MD1024/1010remains good.

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CLC: > Industrial Technology > General industrial technology > Materials science and engineering > Composite materials > Non-metallic composite materials
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