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Nickel-plated brass frame surface modification and improve adhesion of the EMC

Author: LiuLiLong
Tutor: WuXiaoJing
School: Fudan University
Course: Physical Electronics
Keywords: Surface Modification Plasma immersion implantation Nickel-plated copper frame Adhesion Package failure
CLC: TN305.94
Type: Master's thesis
Year: 2011
Downloads: 31
Quote: 0
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With the continuous development of electronic devices, package reliability problems growing concern. Currently plastic packaging and copper-based framework for electronic packaging is the mainstream. Frame with epoxy molding compound (EMC) weak adhesion, adhesion interface delamination often occurs during the reflow process popcorn phenomenon occurs, leading to failure of the entire package, the package common failure phenomenon. Using pre-coating (PPF) technology can improve weldability, but the metal lead frame plating adhesion decreased, but to make failure phenomenon further increased. Through the framework of the modified surface to improve adhesion of the current framework of research. In this thesis, plasma immersion implantation (P Ⅲ) technology injected O2, N2, CO and CO2 plasma, nickel-plated brass frame for surface modification. Using optical microscopy, scanning electron microscopy (SEM), atomic force microscopy (AFM) before and after treatment was observed P Ⅲ technology frame surface morphology, and found that a high surface roughness since the frame, P Ⅲ processing surface morphology of the frame no effect. Through the frame surface wetting studies show, P Ⅲ technology can significantly reduce the contact angle, but maintains a relatively short period of time, encapsulation frame with EMC wet performance is not improved. P Ⅲ cavity through the real-time detection of plasma spectroscopy and found that CO and CO2 consistent with the main component of plasma, but the spectral intensity of CO higher excited state is mainly CO molecules, CO2, CO. By X-ray photoelectron spectroscopy (XPS) analysis of the surface of the frame P Ⅲ chemical state of technology, and found that CO and CO2 frame surface after plasma treatment carbonyl group appears. Tensile tests showed, CO and CO2 plasma treatment to improve adhesion of the framework significant, and 02, and N2 are no significant improvement. The above results can be confirmed: frame material and wetting properties of the surface morphology has little effect on adhesion; P Ⅲ technology CO and CO2 injected plasma carbonyl group introduced onto the surface of the frame, in the package form chemical bonds with EMC is to improve adhesion key. Tensile testing was observed by SEM surface of the framework after the failure, after CO and CO2 plasma treatment framework with EMC adhere to the surface, indicating that frame surface forming a chemical bond with EMC indeed. Besides, the paper also uses heat treatment method for surface modification of the framework, as the reaction of CO and CH4 gases, XPS technology framework for the analysis of surface chemical state. Tensile testing showed that the reaction temperature at 60 ℃, CO and CH4 have made a very good modification effect, adhesion significantly increased; at 100 ℃, CO treatment effect declined. Increase of CO and CH4 respectively the mechanism of adhesion of the study indicated that the mechanism of CO to enhance the adhesion surface of the framework is the introduction of a carbonyl group, the surface of the frame of the CO chemisorption reaction process to generate a carbonyl group; CH4 increased adhesion lies in a carbonyl group or a methoxy group, or both simultaneously.

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Semiconductor technology > General issues > The semiconductor device manufacturing process and equipment > Packaging and cooling issues
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