Dissertation　

About 250 item dissertation in line with Wafer query results,the following is 1 to 50(Search took 0.088 seconds)

  1. Design of Wafer Handing Robot End-effector and Key Technique Research,LiuHongTao/Northeastern University,0/7
  2. Research on Some Problems of Wafer Handling Robot Based on EFEM Module,WangWenZuo/Northeastern University,0/2
  3. Detection Principle of Stick-slip State on Wafer Transmission Surface and Its Sensor Design,WuJiang/Harbin Institute of Technology,0/7
  4. Movement and Measurement Systems Decoupling Algorithm for Wafer Stage and Reticle Stage,LvChen/Harbin Institute of Technology,0/25
  5. Research on Multi-Project Wafer Floorplanning and Dicing Algorithms,ZhangTeng/Zhejiang University,0/6
  6. Research on Yield Predicting Technique and Design for Yield,YeYi/Zhejiang University,0/6
  7. Design and Research of Wafer Test Motion Stage,WangJiaSheng/Huazhong University of Science and Technology,0/6
  8. Host Computer System Development and Implementation of Wafer Stage,HuoMingLei/Harbin Institute of Technology,0/42
  9. The Design and Development of Wafer Alignment Software System of Lithography Tool,SongHaiJun/Dalian University of Technology,0/6
  10. Fundamental Research on Silicon Wafer Thinning by Ultra-precision Grinding,GaoShang/Dalian University of Technology,0/79
  11. Research on Photovoltaic Poly-Silicon Films in Multi-wireCutting Mechanism and Technology,TaoDaQing/Jiangsu University of Science and Technology,0/4
  12. Research on Pulsating Torque for Brushless DC Motor in Wafer Cleaning Machine,DuChengFei/Hubei University of Technology,0/1
  13. Research on Mechanism of Contact Type Ultrasonic Vibration in the CMP,LiuZheng/Liaoning University of Technology,0/23
  14. Study of Graphene Formation on Insulated Substrates and Its Mechanism,XingYanMin/Central China Normal University,0/0
  15. Fluorescence enhancement of self-assembly of silver nanoparticles surface silicon,ZuoShuai/Shaanxi Normal University,0/89
  16. Analysis of Metal Diffusion in Silicon Wafers by Laser-induced Breakdown Spectroscopy,HuXuanSheng/Hangzhou University of Electronic Science and Technology,0/2
  17. Simulation and Optimization of the Logistics Personnel Configuration in Wafer Production System,GongLongQing/Wuhan University of Technology,0/67
  18. Dynamic Simulation and Trajectory Optimization of Wafer Handling Robot of Large Scale Ultra-precision Grinding Machine,ZhangMeiZhen/Dalian Jiaotong University,0/29
  19. Dynamic Modeling and Analysis of5-DOF Clean Room Wafer Handling Robot,WuJing/Shanghai Jiaotong University,0/67
  20. Study of End-effector Motion and Wafer Contact Status Detecting System for Wafer Transfer Robot,LiKang/Harbin Institute of Technology,0/3
  21. Study and Implementation of Trajectory Planning for Wafer Handling Robot,SunQiang/Dalian University of Technology,0/112
  22. Research on the Application of Visual Inspection Technology in High Precision Wafer Scribing System,CaoChengBing/East China University of Science and Technology,0/55
  23. Research on6-degree-of-freedom Measurement System of Wafer Stage,SongLei/Harbin Institute of Technology,0/12
  24. Overkill wafer test (Overkill) in the diagnosis and treatment,LiFei/Fudan University,0/34
  25. Study on improvement of SMIF micro environment influence on wafer finished in semiconductor manufacture,NiHaiYong/Fudan University,0/12
  26. Study on the fluctuation of the lithography process on the wafer edge in IC manufacturing,MaoAnKun/Fudan University,0/84
  27. Research on the Positioning System of Wafer Based on Machine Vision,XiaoMin/Shanghai Jiaotong University,0/73
  28. Design and Implementation of Wafer Bonder’s Control System,LiHao/North China Electric Power University,0/9
  29. Wafer Dies Counting Based on Computer Vision,GaoYang/Guangdong University of Technology,0/12
  30. Research on Test Chip Layout Automation and Yield Improvement of Integrated Circuit,ZhangBo/Zhejiang University,0/153
  31. Basic Research on Hybrid Technology of Ultrasonic Vibration Assisted Chemical-Mechanical Grinding Silicon Wafer,WangChen/Jiangxi Agricultural University,,0/38
  32. Research on Key Process of MEMS Wafer-Level Vacuum Packaging,WangYuZhe/Huazhong University of Science and Technology,0/89
  33. Chemical mechanical polishing of the surface contact analysis of Cu / low-k dielectric,ZhengGuangFeng/Taiyuan University of Science and Technology,0/69
  34. Research on reliability of wafer level packaging board level drop,YeXiaoTong/Fudan University,0/88
  35. Research on reliability of wafer level chip size package thermal - Mechanical,HongRongHua/Fudan University,0/125
  36. Investigation of Low-Temperature Wafer Bonding Technology and Its Application in Si-Based Long Wavelength Avalanche Photodetector,SongHaiLan/Beijing University of Posts and Telecommunications,0/90
  37. Parameter Extraction and Modeling Techniques for RF and Microwave MOSFETs,ChengJiaLi/East China Normal University,1/320
  38. Research of white LED encapsulation technology based on the wafer surface coating,DingKun/University of Electronic Science and Technology,0/56
  39. Research on Temperature Field of Lithography Dual Drive Wafer Stage,NiuChengCheng/Harbin Institute of Technology,0/2
  40. Design and Optimization of VxWorks Software for Dual Wafer Stage,BiYanShuai/Harbin Institute of Technology,0/5
  41. Research on Wafer Backside Discolor Issue,LiangHaiHui/Shanghai Jiaotong University,0/18
  42. Design and Alignment Algorithm Study of Pre-Aligner,LiangJiaXin/Shanghai Jiaotong University,0/23
  43. The Application and Optimization of Endura Tool in Semiconductor Manufacturing,ZhangYanPeng/Tianjin University,0/11
  44. FMECA for Dual-stage System of Lithography Machine,ZengJiDong/University of Electronic Science and Technology,0/6
  45. Damage Detection Research on the Surface Layer of the Lapped SiC Wafer,YangLeLe/Zhengzhou University,0/22
  46. Dynamical and Control Co-simulation of Wafer Stage,LuoJian/Huazhong University of Science and Technology,0/35
  47. Researches on Scheduling Problems of Semiconductor Wafer Fabrication Based on Batching Decision,ZhangQiongFang/Wuhan University of Technology,0/34
  48. Wafer Defects Issue Study in Lithography,LiuFeng/Tianjin University,0/93
  49. Study on Material Removal Non-uniformity of Silicon Wafer in Double-side Chemical Mechanical Polishing,WangYongTao/Beijing Nonferrous Metal Research,0/96
  50. Theoretical and Experimental Study of Noncontact Handling and Transportation System Based on Near Field Acoustic Levitation,LiJin/Shanghai Jiaotong University,2/130

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