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The Application of Failure Analysis for DRAM Product

Author: LinZhaoYing
Tutor: ZhangShiLinï¼›LiRiZuo
School: Tianjin University
Course: IC Engineering
Keywords: DRAM (Dynamic Random Access Memory) Wafer Failure Analysis IC Yield
CLC: TN407
Type: Master's thesis
Year: 2010
Downloads: 84
Quote: 0
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Abstract


Failure analysis through the analysis of the failure of the device to identify the failure mechanism , suggest improvements to improve the yield and reliability of the product . In product design , development, production , reliability test and quality information feedback process , failure analysis are inseparable . IC industry to today's stage , failure analysis technology has become an integral part of any advanced IC foundry , and analysis tools . Especially when the process step by step development of deep sub-micron , the increasingly thin film deposition , Defect affecting device performance is growing more and more requirements for failure analysis . At home and abroad in recent years in the semiconductor component failure analysis field using new analytical technologies and means , such as: optical microscopy , scanning electron microscopy , and focused ion beam microscopy , transmission electron microscopy , energy dispersive analyzer . Aspects of the structure and working principle as well as the application of these failure analysis tools commonly used are described in detail, these state - of - the - art instruments with a high-resolution , high-accuracy advantages , in the IC process monitoring and failure analysis applications become more prevalent and important . Greatly promote the application of these technologies and means of the development of the electronic components failure analysis techniques , to further deepen the failure mechanism research . This thesis discusses in detail the failure analysis DRAM products and how through failure analysis to improve product yield . By enumerating the number of actual cases to enable the reader to understand the steps and methods of failure analysis , and then recognize the failure analysis plays an irreplaceable role in the improvement of the yield of IC products . Failure analysis techniques for semiconductor process as a whole is an important part of the essential , to identify the root causes of failure , improvement measures are proposed to improve the level of product quality .

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Microelectronics, integrated circuit (IC) > General issues > Testing and inspection
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