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Study on Glass-ceramics of Low-temperature Anodic Bonding for Application in MEMS

Author: LiHong
Tutor: ChengJinShu
School: Wuhan University of Technology
Course: Materials Science
Keywords: Glass Anodic bonding Stainless steel Wafer Micro-electromechanical systems (MEMS)
CLC: TQ171.1
Type: PhD thesis
Year: 2008
Downloads: 324
Quote: 1
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MEMS (Micro-Electro-Mechanical Systems, referred MEMS) in microelectronic technology developed on the basis of cutting-edge interdisciplinary research field of complex micro-electromechanical systems, often need to encapsulate the substrate structure, packaging technology is MEMS system is a key technology, and bonding technology is the most important types of packaging method of a class. Anodic bonding cooperation in the MEMS system used in an important bonding technology with a simple process, high bonding strength, good sealing, etc., are widely used in microelectronics and MEMS technology and other fields. Development of low temperature, low voltage anodic bonding, to avoid high temperature, high voltage caused by the breakdown of material, damage to electronic components, materials, oxidation and thermal stresses and other undesirable phenomena. While low temperature anodic bonding of the MEMS packaging technology selectively broader applications are more widely. Therefore, with the research fast, low-temperature, high-quality anodic bonding technology, seeking to meet the requirements of the new material would have important practical significance. With conventional bonding substrate material compared to glass, glass-ceramic systems are widely known for its variety, excellent performance, especially its thermal expansion coefficient is adjustable in a wide range known, the subject in order to replace the traditional glass resistant hot glass substrate as an anode material bonding, by selecting the appropriate glass composition system, optimizing its heat treatment, the main crystal phase control type, content and grain size, adjust the thermal expansion coefficient, so that the silicon sheet metal (stainless steel) and other bonding materials approximate matching, bonding to reduce stress, lower bonding temperature, to improve the quality of bonding purposes; while the anode of the anodic bonding apparatus for bonding and bonding properties of experimental tests, and detailed analysis of the bonding process parameters on the quality of bonding, explore the bonding process between the system and the impact of the bonding properties of the law; won the bonding interface microstructural features, and silicon / glass anodic bonding temperature conducted research and exploration, initially established glass and silicon, metal (stainless steel) materials such as anodic bonding model. The main research content and the concrete results achieved are: (1) a comprehensive overview paper the development of micro-electromechanical systems, detailed analysis of the various advantages and disadvantages of bonding method and anodic bonding technology in the future direction of development. Depth study of the glass as a packaging material or a good feasibility of bonding materials, focusing on low temperature anodic bonding of purpose and meaning, and a brief introduction of the research paper, research objectives, the technical route and experimental processes. (2) System-depth study and metal bonded Li 2 O-Al 2 O 3 -ZnO-SiO 2 (LAZS) system glass composition, structure and properties of the relationship between its variation. By optimizing the base glass composition and the corresponding heat treatment, the glass bonding material and its thermal expansion coefficient close match to the bonding interface to reduce the residual stress and improve the bonding quality purposes. By DTA, XRD, SEM and related test methods, focusing on analysis discusses the heat treatment on the main phase, grain size, degree of crystallization and its related properties. The experimental results showed that: glass thermal expansion coefficient of the sample can reach 131.6 × 10 -7 / ℃ -142.32 × 10 -7 / ℃, the maximum bending strength of 95.91 MPa, with good resistance to acid corrosion. Thus LAZS system glass thermal, mechanical and chemical stability and other properties sufficient to meet with the selected metals (stainless steel) for a good anodic bonding. (3) comprehensive and systematic study of the silicon-bonded Li 2 O-Al 2 O 3 -SiO 2 < / sub> (LAS) system glass. By differential thermal analysis method to study the LAS system based glass crystallization kinetics using Kissinger, JMA equation of the system and its amendments glass crystallization activation energy and other kinetic parameters, analysis of lithium aluminum than its crystallization kinetics the impact mechanism. Explores LAS glass composition, structure and thermal expansion properties between the three, focusing on the composition of compound nucleating agents on glass crystallization, microstructure and thermal expansion coefficient. (4) using the optimized component and two-step heat treatment were prepared by the thermal expansion coefficient of silicon approximate matching LAS system glass and glass-ceramic thermal expansion coefficient test, flexural strength and other basic performance, but focuses on the micro- crystal glass, electrical properties (dielectric properties, resistivity, etc.), for the latter bonding mechanism of creation of favorable conditions. The results showed that: Glass resistivity at room temperature is greater than the base glass, and with increasing temperature resistivity of a downward trend; glass dielectric constant and dielectric loss was less than the base glass. The dielectric performance, LAS system glass is more suitable as an electronic device packaging materials, insulation. (5) carried out the innovative stainless steel / glass, silicon / glass anodic bonding experiment. According to the particularity of different bonding materials, select a different bonding process parameters were anodic bonding experiment. Through observation of the bonded condition and bonding strength tests, analysis of the voltage, temperature, time and pressure bonding process parameters on the effect of the bonding, low temperature bonding process discussed parameters and the change between the bonding properties law. (6) test using deionized water, special chemical solvents and plasma etching a substrate material in three different surface treatments, comparative analysis of the different surface treatment methods for anodic bonding quality; detailed analysis of the anodic co-factors, systematic review of the five kinds of anodic bonding strength of characterization methods: analysis by detecting the bonding interface morphology and structural characteristics, and silicon / glass anodic bonding temperature was studied and exploration, initially established silicon / glass, metal / glass anodic bonding model. (7) made a simple anodic bonding device (atmosphere), and the acquisition of a set of vacuum anodic bonding equipment; around the contents of the study carried out in conjunction with the introduction of a set of building schools 211 U.S. imports grinding throwing device, use School configure a set of research and special funds imported from Japan Digital Microscope System. Glass anodic bonding research is more integrated areas of research, which involves glass science, crystallography, physics, chemistry, and precision machining technology and testing technology and other subjects, research has some difficulties, but its application prospect very broad. In this study, instead of the traditional glass-ceramic heat-resistant glass and stainless steel and silicon as anodic bonding material, breaking the tradition of glass and stainless steel applications for the construction of new MEMS devices to explore a wider range of sources of material. Therefore, for the research projects, has important academic value and practical significance. This research was supported by the National Natural Science Foundation of China (50472039) and the Natural Science Foundation of Hubei Province (2005ABA011) funding.

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