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Research on Temperature Field of Polishing Silicon Wafer with Ice Fixed Abrasives

Author: ZhaoYuFei
Tutor: ZuoDunWen
School: Nanjing University of Aeronautics and Astronautics
Course: Mechanical Manufacturing and Automation
Keywords: Temperature field Finite element method Polishing Cryogenic freezing abrasive
CLC: TG73
Type: Master's thesis
Year: 2009
Downloads: 33
Quote: 0
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Abstract


Widely used in the chemical mechanical polishing of semiconductor materials, optical materials such as glass polishing . In low temperature frozen abrasive chemical mechanical polishing , the ice frozen abrasive body temperature , melting faster processing of the specimen surface properties and the material removal rate has a direct impact . To carry out a study of the temperature field in the polishing process has a very important significance . The the cryogenic freezing abrasive polishing silicon heat transfer model , the process of heat conduction with the finite element software ANSYS simulation, analysis of the low-temperature frozen abrasive polishing process three - dimensional transient temperature field . The finite element model takes into account the forced convection heat transfer and radiation heat transfer , simplify the friction and heat load heat flux into the workpiece and the abrasive contact heat transfer method specimen and abrasive absorb heat secondary assignment. Polygon movement analog eccentric rotation of the workpiece , the the conversion unit attributes to resolve frozen abrasive phase transition . In finite element analysis of temperature field Wintour frozen abrasive polishing time , the thickness of the melting temperature-time changes and work area changes over time . The experimental method the cryogenic freezing abrasive temperature changes in the characteristics of the thickness of the melt with time , the initial temperature of the ice body , and the polishing time of impact on the temperature and the melting speed of abrasive . Compared under the same conditions , the experimental and finite element analysis results to verify the validity of the finite element analysis model . Using parameterized finite element model of fixed polishing ambient temperature T2 = 10 ° C and the the low abrasive initial temperature T1 = -10 ° C , polishing time on the temperature field and polishing parameters ( eccentricity , polishing pressure and spindle speed ) three-dimensional transient temperature field of frozen abrasive . The results show that : the polishing pressure , eccentricity significant impact on the rate of melting of the abrasive . With the extension of the polishing time , the temperature rise speed of the abrasive slows the abrasive at the same time accelerate the rate of melting . Analysis to determine a reasonable polishing process parameters ( eccentricity e = 20 mm the the polishing pressure P = 0.075 MPa , spindle speed w = 300 r / min ) , the low - temperature fixed abrasive polishing silicon temperature field theory guidance.

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CLC: > Industrial Technology > Metallurgy and Metal Craft > Cutting tools, abrasives,abrasive tools,fixtures,molds and hand tools > Abrasive
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