Dissertation　

About 43 item dissertation in line with diffusion barrier query results,the following is 1 to 50(Search took 0.036 seconds)

  1. The Effect of Microstructure of Diffusion Barrier on Pumping Current in an Universal Exhaust Oxygen Sensor,TanCui/Huazhong University of Science and Technology,0/7
  2. Study and exploration of new cathode materials for lithium ion batteries,ZhangShiMing/Shanghai University of Electric Power,0/13
  3. The Preparation and Properties of Al/Cu Composite Bonding Pad,YueAnNa/Hunan University,0/2
  4. Research on Novel Copper Contact and the Impacts of Slurry on Low-k Dielectric,ZhangXiaoMeng/Fudan University,0/43
  5. Research on the CMP of Patterned Copper Interconnect Structures with New Diffusion Barriers,WangYongWei/Fudan University,0/61
  6. Chemical mechanical polishing of the surface contact analysis of Cu / low-k dielectric,ZhengGuangFeng/Taiyuan University of Science and Technology,0/69
  7. Investigation of STM Tip-induced Atomic Manipulation on Metal Substrates,LiuLiu/Shenyang Normal,0/85
  8. Investigation on Hydrogen Storage Properties of Lithium Amidoborane and Single Aln Sheet,YangWenJing/Shenyang Normal,0/30
  9. Study on the Interfacial Diffusion Behaviors of SiC Continuous Fiber Reinforced Ti-Matrix Composites,LvXiangHong/Northwestern Polytechnical University,1/705
  10. Chemical Vapor-deposited Copper Thin Films on Self-assembled Monolayers,LiuZuo/Zhejiang University,0/289
  11. Ta films by plasma immersion implantation on Modification and Cu/Ta-X/SiO_2 System Failure Mechanism,JiangSuHua/Fudan University,1/166
  12. IC Cu interconnection process in a diffusion barrier layer of Ta-based,JiangLei/Fudan University,3/363
  13. Advanced the study of the diffusion barrier layer in the IC copper interconnect process,XieZuo/Fudan University,2/335
  14. Theoretical and experimental studies of new copper interconnect adhesion layer / diffusion barrier material,DingShaoFeng/Fudan University,2/149
  15. Properties, Preparation and Applications of Self-assembled Monolayers on Silicon/Silica Surfaces,KongZhe/Zhejiang University,0/311
  16. ULK SiOCH film and its interaction with the diffusion barrier layer research,YangChunXiao/Fudan University,0/73
  17. Study of the Weather Derivatives Pricing Problems,FuYi/Shanghai Normal University,0/196
  18. Preparation of tantalum silicon nitride diffusion barrier layer and the barrier characteristic IC copper interconnect,LiuZheng/Central South University,4/163
  19. The DFT Study of Diffusion Barrier and kMC Simulation of Long-range Interactions on Cu(111) Surface,HuJuanMei/Zhejiang Normal University,0/111
  20. Effects of Organic Functional Groups of Self-assembled Monolayers on Chemical Vapor-deposited Copper Films,LiuZuoZuo/Zhejiang University,0/70
  21. Preparation and characterization of the new generation of integrated circuits Cu interconnects with Ta-based diffusion barrier,ChenHaiBo/Central South University,3/207
  22. Theoretical study of the diffusion behavior of helium atoms in the metal vanadium , titanium,WuZhongCheng/Chinese Academy of Engineering Physics , Beijing Graduate School,1/304
  23. Influence of 3D Islands on the Adatom Diffusion and the Local Pressure of the Atoms in the Substrates,TangZuo/Dalian University of Technology,1/101
  24. First-Principle Investigation of Li Diffusion in Copper Thin Film,XiongZhiHua/Jiangxi Normal University,2/234
  25. Study of the Materials of Piece Type Limiting Current Oxygen Sensor with Dense Diffusion Barrier,WuBangJun/Huazhong University of Science and Technology,0/156
  26. The 45nm copper interconnects and copper contact process - oriented ultra-thin diffusion barrier layer,ZhouMi/Fudan University,2/224
  27. Dense diffusion barrier limiting current oxygen sensor Preparation and properties of the oxygen -sensitive,XieGuiJiu/Tianjin University,1/164
  28. Preparation and characterization of integrated circuit copper interconnect dielectric barrier layer of silicon carbonitride,ShiZhiJie/Central South University,3/84
  29. Material Design and Properties Investigation of Ni Plating Coating on the Surface of Low Carbon Steel,LiWeiSheng/Xiamen University,0/137
  30. The Research of Dense Diffusion Barrier Oxygen Sensor,ZouJie/Ningbo University,0/71
  31. Preparation and Characterization of Barrierless Cu (Sn), Cu (C),Cu(Sn,C) Films,XuLiYan/Dalian University of Technology,1/22
  32. Research on Atomic Layer Deposition TiN Barrier Layer in Through Silicon Via Interconnection,ZhangWenJie/Dalian University of Technology,0/181
  33. Preparation and Characterization of Ru-TiN Diffution Barrier,SunYuFang/Harbin Institute of Technology,0/24
  34. Barrierless Cu-Ni-Mo Ternary Alloy Films Based on the Stable Solid Solution Cluster Model,ZhangXinZuo/Dalian University of Technology,2/40
  35. Study on Tantalumnitride Diffusion Barrier of Copper Metallization,CaoShiCheng/Harbin Institute of Technology,0/92
  36. Advanced Technology Research copper contact diffusion barrier layer,ZhaoYing/Fudan University,0/78
  37. The Study on Reactive Wettability of SnAgCu Solder Alloy on Au/NiFe/Cu PAD,LiXueTao/Harbin Institute of Technology,0/49
  38. Preparation and Characterization of Diffusion Barrier and Absorbing Layer for Flexible CIGS Solar Cell,FanQingXi/Xiangtan University,0/124
  39. The Studied of Ohmic Contact on the InGaAsSb Semiconductor Lasers,LiJunCheng/Changchun University of Science and Technology,0/38
  40. Investigation of Ni-Al Barrier Layer for Integrating Si-based Ferroelectric Capacitors with Copper,HuoZuoChuan/Hebei University,0/9
  41. RuTi based monolayer film as diffusion barrier of copper interconnect,LiZuo/Fudan University,0/4
  42. Preparation of W-10%Ti Alloys,SongJia/Harbin Institute of Technology,0/110
  43. Copper diffusion barrier layer self-assembly process research,ZhouTong/Fudan University,0/61

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